502 lines
36 KiB
HTML
502 lines
36 KiB
HTML
<!DOCTYPE html>
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<html lang="zh-CN" data-theme="night">
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<head>
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<meta charset="UTF-8">
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<meta name="viewport" content="width=device-width, initial-scale=1.0">
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<title>HBM (高带宽内存) 深度研究报告</title>
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<script src="https://cdn.tailwindcss.com"></script>
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<link href="https://cdn.jsdelivr.net/npm/daisyui@4.10.1/dist/full.min.css" rel="stylesheet" type="text/css" />
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<style>
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body {
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font-family: 'Inter', sans-serif;
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background-color: #020617;
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background-image:
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radial-gradient(at 27% 37%, hsla(215, 98%, 61%, 0.1) 0px, transparent 50%),
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color: #e2e8f0;
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}
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.glass-card {
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background: rgba(15, 23, 42, 0.3);
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backdrop-filter: blur(16px) saturate(180%);
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-webkit-backdrop-filter: blur(16px) saturate(180%);
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border: 1px solid rgba(255, 255, 255, 0.1);
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border-radius: 1.5rem;
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box-shadow: 0 8px 32px 0 rgba(0, 0, 0, 0.37);
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}
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.title-font {
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font-family: 'Space Grotesk', sans-serif;
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}
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.glow-text {
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text-shadow: 0 0 8px rgba(165, 180, 252, 0.5), 0 0 16px rgba(129, 140, 248, 0.4);
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}
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.section-title {
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@apply title-font text-3xl font-bold text-indigo-300 glow-text mb-6;
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}
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.sub-title {
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@apply title-font text-xl font-semibold text-cyan-300 mt-6 mb-3;
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}
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.key-data {
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@apply text-2xl font-bold text-fuchsia-400;
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.quote {
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@apply border-l-4 border-slate-500 pl-4 italic text-slate-400 my-4;
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}
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</style>
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</head>
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<body class="min-h-screen">
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<div class="container mx-auto p-4 md:p-8">
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<header class="text-center my-12">
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<h1 class="title-font text-5xl md:text-7xl font-bold text-white glow-text leading-tight">HBM (高带宽内存)</h1>
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<h2 class="title-font text-3xl md:text-4xl font-bold text-indigo-300 glow-text mt-2">深度研究报告</h2>
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<p class="mt-6 text-sm text-slate-400 max-w-3xl mx-auto">北京价值前沿科技有限公司 AI投研agent：“价小前投研” 进行投研呈现，本报告为AI合成数据，投资需谨慎。</p>
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</header>
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<main class="space-y-12">
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<!-- Section 0: 概念事件 -->
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<section class="glass-card p-6 md:p-8">
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<h2 class="section-title">0. 概念事件：AI算力竞赛引爆“内存革命”</h2>
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<p class="text-slate-300 leading-relaxed">
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HBM（High Bandwidth Memory，高带宽内存）概念的爆发，源于AI大模型引发的全球算力军备竞赛。传统计算架构遭遇“内存墙”瓶颈——处理器算力增速远超内存带宽增速，成为AI性能提升的核心制约。HBM通过3D堆叠和TSV（硅通孔）技术，实现了超高带宽、低功耗和更小的物理尺寸，成为AI芯片，特别是高端GPU的“刚需”组件。
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</p>
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<div class="quote">
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<p>研报数据：AI服务器对DRAM的需求量是传统服务器的 <span class="font-bold text-teal-300">8倍</span>，HBM占NVIDIA H100芯片BOM成本<span class="font-bold text-teal-300">近50%</span>。</p>
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</div>
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<div class="mt-6 space-y-4">
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<div class="flex items-start space-x-4">
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<div class="flex-shrink-0 h-8 w-8 rounded-full bg-indigo-500/20 border border-indigo-400 flex items-center justify-center title-font font-bold text-indigo-300">1</div>
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<div>
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<p class="font-semibold text-slate-100">市场引爆 (2023至今)</p>
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<p class="text-slate-400 text-sm">NVIDIA的H100/H200及Blackwell系列GPU将HBM作为标配，直接引爆市场需求。</p>
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</div>
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</div>
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<div class="flex items-start space-x-4">
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<div class="flex-shrink-0 h-8 w-8 rounded-full bg-indigo-500/20 border border-indigo-400 flex items-center justify-center title-font font-bold text-indigo-300">2</div>
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<div>
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<p class="font-semibold text-slate-100">供给失衡 (2023-2024)</p>
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<p class="text-slate-400 text-sm">新闻显示，SK海力士和三星均预测HBM供应短缺将持续到2026年，2025年产能已基本售罄。</p>
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</div>
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</div>
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<div class="flex items-start space-x-4">
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<div class="flex-shrink-0 h-8 w-8 rounded-full bg-indigo-500/20 border border-indigo-400 flex items-center justify-center title-font font-bold text-indigo-300">3</div>
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<div>
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<p class="font-semibold text-slate-100">国产化提速 (2024至今)</p>
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<p class="text-slate-400 text-sm">美国将制裁从“算力”延伸至“存力”的担忧加剧，路演信息显示长鑫存储等国内厂商加速研发，大基金三期重点支持。</p>
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</div>
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</div>
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</div>
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</section>
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<!-- Bento Grid & Charts -->
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<section class="grid grid-cols-1 lg:grid-cols-3 gap-6 md:gap-8">
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<!-- Section 1: 核心观点 -->
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<div class="glass-card p-6 md:p-8 lg:col-span-3">
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<h2 class="section-title">1. 核心观点摘要</h2>
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<p class="text-slate-200 leading-relaxed text-lg">
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HBM正处于由AI算力需求驱动的、<span class="font-bold text-rose-400">供需严重失衡</span>的高速成长期，其本质是解决“内存墙”瓶颈的关键技术组件。当前市场的主线逻辑清晰分为两条：一是全球三大巨头（SK海力士、三星、美光）的产能竞赛与技术迭代；二是在地缘政治风险下，中国大陆被迫开启的、从封装到设备材料的全产业链<span class="font-bold text-cyan-400">“国产化突围”</span>，后者蕴含着从0到1的巨大弹性。
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</p>
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</div>
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<!-- Market Size Chart -->
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<div class="glass-card p-6 md:p-8 lg:col-span-2">
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<h3 class="sub-title">全球HBM市场规模预测 (TAM)</h3>
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<div id="marketSizeChart" class="w-full h-80"></div>
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</div>
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<!-- Market Share Chart -->
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<div class="glass-card p-6 md:p-8">
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<h3 class="sub-title">2023年全球市场份额</h3>
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<div id="marketShareChart" class="w-full h-80"></div>
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</div>
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</section>
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<!-- Section 2: 核心逻辑与市场认知 -->
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<section class="glass-card p-6 md:p-8">
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<h2 class="section-title">2. 核心逻辑与市场认知分析</h2>
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<h3 class="sub-title">核心驱动力：技术范式变革带来的确定性需求</h3>
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<p class="text-slate-300 leading-relaxed">
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HBM的根本驱动力是为解决AI时代最核心的物理瓶颈——“内存墙”。其需求具备极高的确定性和刚性，源于底层技术架构的必然演进。
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</p>
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<div class="quote">
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<p>研报数据：处理器算力20年提升 <span class="font-bold text-teal-300">9万倍</span>，而内存带宽仅增长 <span class="font-bold text-teal-300">30倍</span>，这一巨大鸿沟只能通过HBM这类“近存计算”架构来弥合。</p>
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</div>
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<h3 class="sub-title">市场热度与情绪：高度乐观，共识形成</h3>
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<p class="text-slate-300 leading-relaxed">
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市场对HBM概念的关注度极高，情绪整体高度乐观。新闻密集、研报路演扎堆、关联个股大涨，均体现了机构和市场的高度认可。主要分歧点在于对<span class="text-amber-300">国产化进程速度</span>的判断，但对赛道本身的高景气度已形成共识。
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</p>
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<div class="quote">
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<p>"HBM驱动，三星海力士双双大涨。" - *新闻数据*</p>
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</div>
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<h3 class="sub-title">预期差分析：表象之下的三大认知偏差</h3>
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<ul class="list-disc list-inside space-y-3 text-slate-300 pl-2">
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<li><span class="font-semibold text-slate-100">对三星追赶速度的预期差：</span>市场普遍报道三星进入英伟达供应链，但交叉验证表明，其HBM3E良率（路演称仅10-20%）和推出节奏落后SK海力士3-4个季度，追赶之路比市场想象的更为艰难。</li>
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<li><span class="font-semibold text-slate-100">对国产化时间表的预期差：</span>部分路演信息过于乐观（“2024年底量产”）。综合判断，长鑫存储目标是2025年底交付HBM3样品，2026年量产，且与国际主流存在1-2代技术差距。市场可能高估了短期突破速度。</li>
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<li><span class="font-semibold text-slate-100">对产业链瓶颈的认知偏差：</span>市场关注中游明星公司，但真正的瓶颈在于上游<span class="text-rose-400">核心设备（如TCB）和材料（如EMC）</span>。国产化的成败更取决于上游“卡脖子”环节能否突破，这是市场认知可能不足之处。</li>
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</ul>
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</section>
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<!-- Section 3: 催化剂与发展路径 -->
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<section class="glass-card p-6 md:p-8">
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<h2 class="section-title">3. 关键催化剂与未来发展路径</h2>
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<div class="grid grid-cols-1 md:grid-cols-2 gap-8">
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<div>
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<h3 class="sub-title">近期催化剂 (未来3-6个月)</h3>
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<ul class="space-y-3">
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<li class="flex items-start"><span class="text-cyan-400 mr-2">▶</span><div><span class="font-semibold text-slate-100">美国制裁细则落地：</span>新闻提及“对HBM的限制规定将于下月公布”，是短期最大不确定性与催化剂。</div></li>
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<li class="flex items-start"><span class="text-cyan-400 mr-2">▶</span><div><span class="font-semibold text-slate-100">英伟达Blackwell芯片放量：</span>将直接拉动HBM3E需求，并验证各供应商真实供应能力。</div></li>
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<li class="flex items-start"><span class="text-cyan-400 mr-2">▶</span><div><span class="font-semibold text-slate-100">长鑫存储HBM样品进展：</span>任何官方验证消息都将引爆国内产业链。</div></li>
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<li class="flex items-start"><span class="text-cyan-400 mr-2">▶</span><div><span class="font-semibold text-slate-100">关键国产设备/材料验证突破：</span>如精智达获华为订单、华海诚科进入海力士供应链等实质性进展。</div></li>
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</ul>
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</div>
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<div>
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<h3 class="sub-title">长期发展路径</h3>
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<div class="space-y-4">
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<div>
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<h4 class="font-semibold text-slate-100">全球技术路径：HBM3E → HBM4 → HBM4e</h4>
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<p class="text-slate-400 text-sm">核心里程碑是 <span class="text-fuchsia-400 font-bold">Hybrid Bonding (混合键合)</span> 技术的规模化应用，预计在2026年左右实现量产。</p>
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</div>
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<div>
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<h4 class="font-semibold text-slate-100">中国国产化路径：三步走战略</h4>
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<ol class="list-decimal list-inside text-slate-400 text-sm space-y-1 mt-2">
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<li><span class="font-bold">2024-2026：</span>实现HBM2E/HBM3的“从0到1”，打通封装工艺。</li>
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<li><span class="font-bold">2026-2028：</span>追赶HBM3E/HBM4，缩小技术差距，完善供应链。</li>
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<li><span class="font-bold">2028以后：</span>与国际先进水平同步研发。</li>
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</ol>
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</div>
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</div>
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</div>
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</div>
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</section>
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<!-- Section 4: 产业链深度剖析 -->
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<section class="glass-card p-6 md:p-8">
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<h2 class="section-title">4. 产业链与核心公司深度剖析</h2>
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<div id="hbm-chain" class="w-full h-96"></div>
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<h3 class="sub-title">核心玩家对比</h3>
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<div class="grid grid-cols-1 md:grid-cols-2 gap-8">
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<div class="border border-slate-700 p-4 rounded-xl">
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<h4 class="font-bold text-lg text-slate-100">全球格局：领导者 vs. 追赶者</h4>
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<p class="mt-2 text-slate-300"><strong class="text-sky-300">SK海力士 (领导者):</strong> 核心优势在于MR-MUF封装技术带来的高良率和散热性能，HBM3时代独占鳌头。</p>
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<p class="mt-2 text-slate-300"><strong class="text-amber-300">三星电子 (追赶者):</strong> 优势在于庞大产能，但TC-NCF封装技术在多层堆叠下面临良率挑战，是其当前落后主因。</p>
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</div>
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<div class="border border-slate-700 p-4 rounded-xl">
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<h4 class="font-bold text-lg text-slate-100">国内格局：核心 vs. 铲子股</h4>
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<p class="mt-2 text-slate-300"><strong class="text-sky-300">长鑫存储 (CXMT - 核心):</strong> 国产化成败系于一身，其DRAM Die研发进度是整个产业链的“报时鸟”。</p>
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<p class="mt-2 text-slate-300"><strong class="text-amber-300">华海诚科 / 精智达 (潜力铲子股):</strong> 华海诚科塑封料已进入海力士供应链，验证了产品力；精智达HBM测试机成华为独供，实现细分领域突破。逻辑非常硬。</p>
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</div>
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</div>
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<h3 class="sub-title">验证与证伪</h3>
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<p class="text-slate-300 leading-relaxed">
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<span class="text-green-400 font-semibold">[已验证]</span> 设备材料国产替代逻辑：精智达获华为订单、华海诚科进入海力士供应链等新闻强力验证了这一逻辑正在发生。
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</p>
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<p class="text-slate-300 leading-relaxed mt-2">
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<span class="text-yellow-400 font-semibold">[待验证]</span> 国产封测厂商业绩：通富微电、长电科技等何时能从长鑫存储获得批量订单并产生可观收入，是未来的关键验证点。
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</p>
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<p class="text-slate-300 leading-relaxed mt-2">
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<span class="text-blue-400 font-semibold">[交叉验证]</span> 三星的困境：新闻中三星的降价行为，与路演中提到的其良率低、技术落后的说法形成了完美的交叉验证。
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</p>
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</section>
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<!-- Section 5 & 6: 风险与结论 -->
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<section class="grid grid-cols-1 lg:grid-cols-2 gap-6 md:gap-8">
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<!-- 潜在风险 -->
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<div class="glass-card p-6 md:p-8">
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<h2 class="section-title">5. 潜在风险与挑战</h2>
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<ul class="space-y-4">
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<li class="flex">
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<svg class="w-6 h-6 text-red-400 mr-3 flex-shrink-0" fill="none" stroke="currentColor" viewBox="0 0 24 24" xmlns="http://www.w3.org/2000/svg"><path stroke-linecap="round" stroke-linejoin="round" stroke-width="2" d="M12 9v2m0 4h.01m-6.938 4h13.856c1.54 0 2.502-1.667 1.732-3L13.732 4c-.77-1.333-2.694-1.333-3.464 0L3.34 16c-.77 1.333.192 3 1.732 3z"></path></svg>
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<div>
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<h4 class="font-semibold text-red-300">美国制裁升级 (最大风险)</h4>
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<p class="text-slate-400 text-sm">可能将制裁从成品扩大到制造所需的关键设备、EDA工具和核心材料，从根源上扼杀中国HBM产业。</p>
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</div>
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</li>
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<li class="flex">
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<svg class="w-6 h-6 text-amber-400 mr-3 flex-shrink-0" fill="none" stroke="currentColor" viewBox="0 0 24 24" xmlns="http://www.w3.org/2000/svg"><path stroke-linecap="round" stroke-linejoin="round" stroke-width="2" d="M9.663 17h4.673M12 3v1m6.364 1.636l-.707.707M21 12h-1M4 12H3m3.343-5.657l-.707-.707m2.828 9.9a5 5 0 117.072 0l-.548.547A3.374 3.374 0 0014 18.469V19a2 2 0 11-4 0v-.531c0-.895-.356-1.754-.988-2.386l-.548-.547z"></path></svg>
|
||
<div>
|
||
<h4 class="font-semibold text-amber-300">国产化技术瓶颈</h4>
|
||
<p class="text-slate-400 text-sm">国内在TSV、先进封装良率控制方面差距显著，Hybrid Bonding技术几乎空白，存在技术断代风险。</p>
|
||
</div>
|
||
</li>
|
||
<li class="flex">
|
||
<svg class="w-6 h-6 text-yellow-400 mr-3 flex-shrink-0" fill="none" stroke="currentColor" viewBox="0 0 24 24" xmlns="http://www.w3.org/2000/svg"><path stroke-linecap="round" stroke-linejoin="round" stroke-width="2" d="M13 17h8m0 0v-8m0 8l-8-8-4 4-6-6"></path></svg>
|
||
<div>
|
||
<h4 class="font-semibold text-yellow-300">商业化与竞争风险</h4>
|
||
<p class="text-slate-400 text-sm">HBM生产成本高昂，若AI需求放缓或三星发动价格战，可能导致产能过剩，侵蚀利润。</p>
|
||
</div>
|
||
</li>
|
||
</ul>
|
||
</div>
|
||
|
||
<!-- 综合结论 -->
|
||
<div class="glass-card p-6 md:p-8">
|
||
<h2 class="section-title">6. 综合结论与投资启示</h2>
|
||
<p class="text-slate-200 leading-relaxed font-medium">
|
||
HBM在全球已进入<span class="text-green-300">基本面驱动的业绩兑现阶段</span>，而在中国市场，则处于<span class="text-cyan-300">“国产替代”主题驱动的早期阶段</span>。这是一个典型的“全球看业绩，国内看突破”的赛道。
|
||
</p>
|
||
<div class="mt-4 border-t border-slate-700 pt-4">
|
||
<h4 class="sub-title !mt-0 !mb-2">最具投资价值的细分环节：</h4>
|
||
<p class="font-semibold text-xl text-fuchsia-300">上游的设备和材料环节</p>
|
||
<p class="text-slate-400 text-sm mt-1">作为国产化浪潮中“卖水”的角色，受益确定性最高；国产化率接近于0，一旦突破，业绩和估值弹性巨大。</p>
|
||
</div>
|
||
<div class="mt-4 border-t border-slate-700 pt-4">
|
||
<h4 class="sub-title !mt-0 !mb-2">需重点跟踪的关键指标：</h4>
|
||
<ul class="list-disc list-inside text-slate-300 text-sm space-y-1">
|
||
<li>长鑫存储的官方进展 (产业心跳)</li>
|
||
<li>国产设备与材料厂商的订单和收入 (逻辑验证)</li>
|
||
<li>全球HBM ASP (盈利能力)</li>
|
||
<li>美国EAR清单更新 (政策风险)</li>
|
||
</ul>
|
||
</div>
|
||
</div>
|
||
</section>
|
||
|
||
<!-- 股票数据 -->
|
||
<section class="glass-card p-6 md:p-8">
|
||
<h2 class="section-title">HBM 核心产业链标的</h2>
|
||
<div class="overflow-x-auto">
|
||
<table class="table table-zebra w-full">
|
||
<thead>
|
||
<tr class="text-slate-300 title-font text-base">
|
||
<th>股票名称</th>
|
||
<th>股票代码</th>
|
||
<th>核心逻辑</th>
|
||
<th>细分领域</th>
|
||
</tr>
|
||
</thead>
|
||
<tbody>
|
||
<!-- Data will be populated by script -->
|
||
<script>
|
||
const stockData = [
|
||
{"stock":"通富微电","reason":"封装","其他标签":"设备","stock_code":"002156"},
|
||
{"stock":"华海诚科","reason":"环氧塑封","其他标签":"封装材料","stock_code":"688535"},
|
||
{"stock":"精智达","reason":"测试","其他标签":"设备","stock_code":"688627"},
|
||
{"stock":"赛腾股份","reason":"测试","其他标签":"设备","stock_code":"603283"},
|
||
{"stock":"雅克科技","reason":"其他材料","其他标签":"封装材料","stock_code":"002409"},
|
||
{"stock":"中微公司","reason":"TSV","其他标签":"工艺技术","stock_code":"688012"},
|
||
{"stock":"盛美上海","reason":"TSV","其他标签":"工艺技术","stock_code":"688082"},
|
||
{"stock":"拓荆科技","reason":"封装","其他标签":"设备","stock_code":"688072"},
|
||
{"stock":"香农芯创","reason":"分销商","stock_code":"300475"},
|
||
{"stock":"兴森科技","reason":"封装基板","其他标签":"封装材料","stock_code":"002436"},
|
||
{"stock":"深南电路","reason":"封装基板","其他标签":"封装材料","stock_code":"002916"},
|
||
{"stock":"飞凯材料","reason":"环氧塑封","其他标签":"封装材料","stock_code":"300398"},
|
||
{"stock":"上海新阳","reason":"电镀液","其他标签":"封装材料","stock_code":"300236"},
|
||
{"stock":"艾森股份","reason":"电镀液","其他标签":"封装材料","stock_code":"688720"},
|
||
{"stock":"晶方科技","reason":"TSV","其他标签":"工艺技术","stock_code":"603005"},
|
||
{"stock":"光力科技","reason":"封装","其他标签":"设备","stock_code":"300480"},
|
||
{"stock":"天承科技","reason":"封装基板","其他标签":"封装材料","stock_code":"688603"},
|
||
{"stock":"壹石通","reason":"其他材料","其他标签":"封装材料","stock_code":"688733"}
|
||
];
|
||
stockData.forEach(s => {
|
||
document.write(`
|
||
<tr class="hover:bg-slate-700/50">
|
||
<td class="font-semibold text-slate-100">${s.stock}</td>
|
||
<td>${s.stock_code ? `<a href="https://valuefrontier.cn/company?scode=${s.stock_code}" target="_blank" class="text-indigo-400 hover:text-indigo-300 transition-colors">${s.stock_code}</a>` : 'N/A'}</td>
|
||
<td>${s.reason}</td>
|
||
<td>${s['其他标签'] || '制造'}</td>
|
||
</tr>
|
||
`);
|
||
});
|
||
</script>
|
||
</tbody>
|
||
</table>
|
||
</div>
|
||
</section>
|
||
|
||
<!-- 涨幅分析 -->
|
||
<section class="glass-card p-6 md:p-8" x-data="{ openStock: null }">
|
||
<h2 class="section-title">相关个股异动深度解析</h2>
|
||
<div class="space-y-4">
|
||
<script>
|
||
const riseAnalysisData = [
|
||
{"stock":"三超新材","stock_code":"300554","rise_rate":6.02,"trade_date":"2025-09-23","reason":"核心驱动为HBM产业链热度提升，公司核心产品CMP-DISK是HBM制造重要耗材，且为国内唯一量产供应商。单颗HBM需8片CMP-DISK，价值量高。受益于半导体板块整体走强、国产替代主题及小市值高弹性特质。","score":74.69739,"source":"search_rise"},
|
||
{"stock":"三孚股份","stock_code":"603938","rise_rate":10.01,"trade_date":"2025-10-16","reason":"核心驱动为“全球存储芯片涨价+国产HBM紧缺”情绪外溢，资金将公司万吨级电子级TCS重新定价为“HBM外延硅片刚需上游”。公司产品已切入长江存储、长鑫、SK海力士供应链，涨价50%且订单饱和，业绩弹性显著。","score":68.37447,"source":"search_rise"},
|
||
{"stock":"博敏电子","stock_code":"603936","rise_rate":9.97,"trade_date":"2025-07-01","reason":"涨停系“PCB行业景气度上修+小米汽车供应链0→1+HBM IC载板预期”三因子共振。公司合肥扩产项目以HBM用IC载板为主力产品，已对接长鑫存储等待放量。","score":63.633087,"source":"search_rise"},
|
||
{"stock":"海昌新材","stock_code":"300885","rise_rate":20,"trade_date":"2025-08-06","reason":"工信部拟将“高纯球形氧化铝”纳入首批次应用示范目录，公司董秘确认已投产并获HBM客户订单，叠加补贴预期显著抬升吨净利，机构抢先建仓。产品切入HBM封装导热材料，下游客户验证进度领先。","score":63.231567,"source":"search_rise"},
|
||
{"stock":"中孚实业","stock_code":"600595","rise_rate":6.9,"trade_date":"2025-11-03","reason":"典型的“市场热点题材扩散+基本面预期改善”下的补涨行情。核心驱动力是市场对“存储芯片/HBM”概念的狂热情绪，资金向产业链上游“新材料”扩散。公司铝材业务在高端制造（半导体散热）的应用前景被市场挖掘。","score":55.888012,"source":"search_rise"},
|
||
{"stock":"联瑞新材","stock_code":"688300","rise_rate":5.02,"trade_date":"2025-11-06","reason":"核心驱动为AI算力产业链持续高景气下，市场资金向核心上游材料端的深度挖掘。公司作为HBM先进封装关键材料（功能性陶瓷粉体）供应商，在板块轮动中获得“估值修复”和“逻辑补涨”机会。","score":51.571312,"source":"search_rise"}
|
||
];
|
||
riseAnalysisData.forEach((item, index) => {
|
||
let summary = item.reason.split('。')[0] + '。';
|
||
document.write(`
|
||
<div class="collapse collapse-plus glass-card !rounded-xl">
|
||
<input type="radio" name="rise-accordion" ${index === 0 ? 'checked="checked"' : ''} />
|
||
<div class="collapse-title text-xl font-medium title-font">
|
||
<div class="flex justify-between items-center">
|
||
<span>${item.stock} (${item.stock_code}) <span class="text-sm font-normal text-slate-400">${item.trade_date}</span></span>
|
||
<span class="text-green-400 font-bold text-lg">+${item.rise_rate}%</span>
|
||
</div>
|
||
</div>
|
||
<div class="collapse-content">
|
||
<p class="text-slate-300">${item.reason}</p>
|
||
</div>
|
||
</div>
|
||
`);
|
||
});
|
||
</script>
|
||
</div>
|
||
</section>
|
||
</main>
|
||
|
||
<footer class="text-center mt-16 pb-8">
|
||
<p class="text-xs text-slate-500">报告生成时间: ${new Date().toLocaleString()}</p>
|
||
<p class="text-xs text-slate-500 mt-1">免责声明：本报告由AI模型基于公开信息自动生成，仅供研究参考，不构成任何投资建议。投资有风险，入市需谨慎。</p>
|
||
</footer>
|
||
|
||
</div>
|
||
|
||
<script>
|
||
// ECharts Initialization
|
||
document.addEventListener('DOMContentLoaded', function () {
|
||
// Market Size Chart
|
||
const marketSizeChart = echarts.init(document.getElementById('marketSizeChart'));
|
||
const marketSizeOption = {
|
||
tooltip: {
|
||
trigger: 'axis',
|
||
axisPointer: { type: 'shadow' },
|
||
backgroundColor: 'rgba(2, 6, 23, 0.8)',
|
||
borderColor: '#334155',
|
||
textStyle: { color: '#e2e8f0' }
|
||
},
|
||
grid: { left: '3%', right: '4%', bottom: '3%', containLabel: true },
|
||
xAxis: {
|
||
type: 'category',
|
||
data: ['2024E', '2025E', '2028E', '2030E'],
|
||
axisLine: { lineStyle: { color: '#475569' } },
|
||
axisLabel: { color: '#94a3b8' }
|
||
},
|
||
yAxis: {
|
||
type: 'value',
|
||
name: '亿美元',
|
||
axisLine: { show: true, lineStyle: { color: '#475569' } },
|
||
axisLabel: { color: '#94a3b8' },
|
||
splitLine: { lineStyle: { color: '#1e293b' } }
|
||
},
|
||
series: [{
|
||
name: '市场规模',
|
||
type: 'bar',
|
||
barWidth: '60%',
|
||
data: [160, 350, 640, 1000],
|
||
itemStyle: {
|
||
color: new echarts.graphic.LinearGradient(0, 0, 0, 1, [
|
||
{ offset: 0, color: '#818cf8' },
|
||
{ offset: 1, color: '#4f46e5' }
|
||
]),
|
||
borderRadius: [4, 4, 0, 0]
|
||
},
|
||
emphasis: {
|
||
itemStyle: {
|
||
color: new echarts.graphic.LinearGradient(0, 0, 0, 1, [
|
||
{ offset: 0, color: '#a78bfa' },
|
||
{ offset: 1, color: '#7c3aed' }
|
||
])
|
||
}
|
||
}
|
||
}]
|
||
};
|
||
marketSizeChart.setOption(marketSizeOption);
|
||
|
||
// Market Share Chart
|
||
const marketShareChart = echarts.init(document.getElementById('marketShareChart'));
|
||
const marketShareOption = {
|
||
tooltip: {
|
||
trigger: 'item',
|
||
formatter: '{a} <br/>{b}: {c}%',
|
||
backgroundColor: 'rgba(2, 6, 23, 0.8)',
|
||
borderColor: '#334155',
|
||
textStyle: { color: '#e2e8f0' }
|
||
},
|
||
legend: {
|
||
orient: 'vertical',
|
||
left: 'left',
|
||
textStyle: { color: '#94a3b8' }
|
||
},
|
||
series: [{
|
||
name: '市场份额',
|
||
type: 'pie',
|
||
radius: ['50%', '80%'],
|
||
avoidLabelOverlap: false,
|
||
label: { show: false, position: 'center' },
|
||
emphasis: {
|
||
label: { show: true, fontSize: '20', fontWeight: 'bold', color: '#fff' }
|
||
},
|
||
labelLine: { show: false },
|
||
data: [
|
||
{ value: 54, name: 'SK海力士', itemStyle: { color: '#4f46e5' } },
|
||
{ value: 41, name: '三星电子', itemStyle: { color: '#2563eb' } },
|
||
{ value: 5, name: '美光', itemStyle: { color: '#0ea5e9' } }
|
||
]
|
||
}]
|
||
};
|
||
marketShareChart.setOption(marketShareOption);
|
||
|
||
// HBM Chain Chart
|
||
const hbmChainChart = echarts.init(document.getElementById('hbm-chain'));
|
||
const hbmChainOption = {
|
||
tooltip: {
|
||
trigger: 'item',
|
||
triggerOn: 'mousemove',
|
||
backgroundColor: 'rgba(2, 6, 23, 0.8)',
|
||
borderColor: '#334155',
|
||
textStyle: { color: '#e2e8f0' }
|
||
},
|
||
series: {
|
||
type: 'sankey',
|
||
layout: 'none',
|
||
emphasis: { focus: 'adjacency' },
|
||
nodeAlign: 'right',
|
||
data: [
|
||
{ name: '上游', itemStyle: { color: '#0ea5e9'} },
|
||
{ name: '设备', itemStyle: { color: '#6366f1'} },
|
||
{ name: '材料', itemStyle: { color: '#8b5cf6'} },
|
||
{ name: '中游', itemStyle: { color: '#ec4899'} },
|
||
{ name: 'DRAM Die', itemStyle: { color: '#f43f5e'} },
|
||
{ name: '下游', itemStyle: { color: '#10b981'} },
|
||
{ name: '先进封装', itemStyle: { color: '#22c55e'} },
|
||
{ name: 'HBM成品' , itemStyle: { color: '#f59e0b'}}
|
||
],
|
||
links: [
|
||
{ source: '上游', target: '设备', value: 5 },
|
||
{ source: '上游', target: '材料', value: 5 },
|
||
{ source: '设备', target: '中游', value: 5 },
|
||
{ source: '材料', target: '中游', value: 5 },
|
||
{ source: '中游', target: 'DRAM Die', value: 10 },
|
||
{ source: 'DRAM Die', target: '下游', value: 10 },
|
||
{ source: '下游', target: '先进封装', value: 10 },
|
||
{ source: '先进封装', target: 'HBM成品', value: 10 }
|
||
],
|
||
lineStyle: {
|
||
color: 'gradient',
|
||
curveness: 0.5
|
||
},
|
||
label: {
|
||
color: '#e2e8f0'
|
||
}
|
||
}
|
||
};
|
||
hbmChainChart.setOption(hbmChainOption);
|
||
|
||
window.addEventListener('resize', function () {
|
||
marketSizeChart.resize();
|
||
marketShareChart.resize();
|
||
hbmChainChart.resize();
|
||
});
|
||
});
|
||
</script>
|
||
</body>
|
||
</html> |