662 lines
32 KiB
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662 lines
32 KiB
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<title>改良型半加成工艺mSAP - 行业洞察与投资分析</title>
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<div class="text-center mb-12">
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<h1 class="text-4xl md:text-5xl font-bold mb-4 highlight">改良型半加成工艺mSAP</h1>
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<p class="text-lg text-cyan-200 max-w-3xl mx-auto">AI硬件升级的"隐形冠军"，PCB技术革命的核心驱动力</p>
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</div>
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<!-- 概念事件 -->
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<div class="p-6 md:p-8">
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<h2 class="text-2xl font-bold mb-6 section-title">概念事件</h2>
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<div class="mb-6">
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<h3 class="text-xl font-semibold mb-3 text-cyan-300">背景</h3>
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<p class="text-gray-200 leading-relaxed">
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mSAP（Modified Semi-Additive Process）是介于传统减成法（线宽≥40μm）与全加成法（SAP，线宽≤10μm）之间的PCB制造工艺，通过超薄铜箔（1.5-3μm）和选择性电镀实现<span class="text-cyan-300 font-semibold">15μm以下线宽</span>，适用于高密度互连（HDI）、类载板（SLP）及IC载板。
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</p>
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</div>
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<div>
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<h3 class="text-xl font-semibold mb-3 text-cyan-300">催化事件</h3>
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<div class="space-y-4">
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<div class="timeline-item pb-4">
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<div class="font-semibold text-cyan-200">2025年7月28日</div>
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<p class="text-gray-200">海外大厂下一代机柜产品确认采用mSAP工艺，引发市场对PCB技术升级的强烈预期（新闻）。</p>
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</div>
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<div class="timeline-item pb-4">
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<div class="font-semibold text-cyan-200">2025年7月29日</div>
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<p class="text-gray-200">天风证券提出"CoWoP（芯片直接封装到PCB）"将推动mSAP需求，PCB板块当日大涨（研报）。</p>
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</div>
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<div class="timeline-item pb-4">
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<div class="font-semibold text-cyan-200">2025年8月4日</div>
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<p class="text-gray-200">申万电子将鹏鼎控股列为8月金股，强调其mSAP技术在GB300服务器中的核心地位（研报）。</p>
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</div>
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</div>
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</div>
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</div>
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</div>
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<!-- 核心观点摘要 -->
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<div class="card card-gradient shadow-xl mb-10 rounded-xl overflow-hidden">
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<div class="p-6 md:p-8">
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<h2 class="text-2xl font-bold mb-6 section-title">核心观点摘要</h2>
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<div class="grid grid-cols-1 md:grid-cols-3 gap-6">
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<div class="bg-slate-800/50 p-5 rounded-lg border-l-4 border-cyan-400">
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<h3 class="text-lg font-semibold mb-2 text-cyan-300">当前阶段</h3>
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<p class="text-gray-200">mSAP已从<span class="text-cyan-300 font-semibold">技术验证期</span>进入<span class="text-cyan-300 font-semibold">商业化放量前夜</span>，由AI服务器、光模块等高端需求驱动，2025-2026年或为渗透率拐点。</p>
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</div>
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<div class="bg-slate-800/50 p-5 rounded-lg border-l-4 border-cyan-400">
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<h3 class="text-lg font-semibold mb-2 text-cyan-300">核心驱动力</h3>
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<p class="text-gray-200"><span class="text-cyan-300 font-semibold">CoWoP封装革命</span>（跳过封装基板直接焊芯片到PCB）+ <span class="text-cyan-300 font-semibold">1.6T光模块</span>（需20μm线宽）+ <span class="text-cyan-300 font-semibold">苹果折叠屏SLP</span>（ASP翻倍）。</p>
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</div>
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<div class="bg-slate-800/50 p-5 rounded-lg border-l-4 border-cyan-400">
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<h3 class="text-lg font-semibold mb-2 text-cyan-300">未来潜力</h3>
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<p class="text-gray-200">若CoWoP成为主流，PCB价值量或提升<span class="text-cyan-300 font-semibold">3-5倍</span>（从基板成本转移至PCB），mSAP工艺公司迎来<span class="text-cyan-300 font-semibold">戴维斯双击</span>。</p>
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</div>
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</div>
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</div>
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</div>
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<!-- 核心逻辑与市场认知分析 -->
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<div class="card card-gradient shadow-xl mb-10 rounded-xl overflow-hidden">
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<div class="p-6 md:p-8">
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<h2 class="text-2xl font-bold mb-6 section-title">核心逻辑与市场认知分析</h2>
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<div class="grid grid-cols-1 md:grid-cols-2 gap-8">
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<div>
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<h3 class="text-xl font-semibold mb-4 text-cyan-300">核心驱动力</h3>
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<ul class="space-y-3">
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<li class="flex items-start">
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<i class="fas fa-microchip text-cyan-400 mt-1 mr-3"></i>
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<div>
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<span class="font-semibold text-cyan-200">技术刚需</span>
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<p class="text-gray-200 text-sm">传统减成法无法满足AI芯片的<span class="text-cyan-300">高频高速+高密度</span>需求（如GB300需46层正交背板，线宽≤15μm）。</p>
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</div>
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</li>
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<li class="flex items-start">
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<i class="fas fa-coins text-cyan-400 mt-1 mr-3"></i>
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<div>
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<span class="font-semibold text-cyan-200">成本重构</span>
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<p class="text-gray-200 text-sm">CoWoP取消封装基板（占成本30%），将价值转移至PCB，mSAP成为<span class="text-cyan-300">唯一可行工艺</span>。</p>
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</div>
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</li>
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<li class="flex items-start">
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<i class="fas fa-flask text-cyan-400 mt-1 mr-3"></i>
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<span class="font-semibold text-cyan-200">材料升级</span>
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<p class="text-gray-200 text-sm">需配套<span class="text-cyan-300">超薄载体铜箔（DTH，1.5μm）</span>和<span class="text-cyan-300">Low-CTE电子布</span>，形成<span class="text-cyan-300">工艺-材料</span>闭环（天风建材）。</p>
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</div>
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</li>
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</ul>
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</div>
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<div>
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<h3 class="text-xl font-semibold mb-4 text-cyan-300">市场热度与预期差</h3>
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<div class="mb-4">
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<span class="font-semibold text-cyan-200">新闻/研报密集度</span>
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<p class="text-gray-200 text-sm">7月28-29日3篇重磅研报（天风、申万、广发电新），<span class="text-cyan-300">"PCB半导体化"</span>成为关键词。</p>
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</div>
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<div class="mb-4">
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<span class="font-semibold text-cyan-200">情绪分歧</span>
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<p class="text-gray-200 text-sm">部分投资者认为mSAP是"旧瓶装新酒"（鹏鼎2017年已量产），但<span class="text-cyan-300">CoWoP的增量逻辑未被充分定价</span>。</p>
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</div>
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<div>
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<span class="font-semibold text-cyan-200">预期差</span>
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<p class="text-gray-200 text-sm">mSAP对<span class="text-cyan-300">上游材料</span>（DTH铜箔、Low-CTE布）的拉动远超PCB厂，<span class="text-cyan-300">德福科技（载体铜箔）</span>和<span class="text-cyan-300">宏和科技（电子布）</span>弹性更大。</p>
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</div>
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</div>
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</div>
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</div>
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</div>
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<!-- 关键催化剂与未来发展路径 -->
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<div class="card card-gradient shadow-xl mb-10 rounded-xl overflow-hidden">
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<div class="p-6 md:p-8">
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<h2 class="text-2xl font-bold mb-6 section-title">关键催化剂与未来发展路径</h2>
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<div class="grid grid-cols-1 md:grid-cols-2 gap-8">
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<div>
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<h3 class="text-xl font-semibold mb-4 text-cyan-300">近期催化剂（3-6个月）</h3>
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<ol class="space-y-3">
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<li class="flex items-start">
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<span class="bg-cyan-500 text-slate-900 font-bold rounded-full w-6 h-6 flex items-center justify-center mr-3 flex-shrink-0">1</span>
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<div>
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<span class="font-semibold text-cyan-200">GB300服务器量产</span>
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<p class="text-gray-200 text-sm">（2025Q4）：鹏鼎控股确认9月成为核心供应商，<span class="text-cyan-300">mSAP背板订单落地</span>。</p>
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</div>
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</li>
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<li class="flex items-start">
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<span class="bg-cyan-500 text-slate-900 font-bold rounded-full w-6 h-6 flex items-center justify-center mr-3 flex-shrink-0">2</span>
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<div>
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<span class="font-semibold text-cyan-200">1.6T光模块招标</span>
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<p class="text-gray-200 text-sm">中际旭创等龙头启动mSAP PCB采购，<span class="text-cyan-300">胜宏科技</span>（正交背板供应商）受益。</p>
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</div>
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</li>
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<li class="flex items-start">
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<span class="bg-cyan-500 text-slate-900 font-bold rounded-full w-6 h-6 flex items-center justify-center mr-3 flex-shrink-0">3</span>
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<div>
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<span class="font-semibold text-cyan-200">苹果折叠屏SLP</span>
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<p class="text-gray-200 text-sm">2026年ASP翻倍，<span class="text-cyan-300">鹏鼎/东山精密</span>份额争夺。</p>
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</div>
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</li>
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</ol>
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</div>
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<div>
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<h3 class="text-xl font-semibold mb-4 text-cyan-300">长期路径</h3>
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<div class="space-y-4">
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<div class="bg-slate-800/50 p-4 rounded-lg">
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<div class="font-semibold text-cyan-200 mb-1">2025-2026</div>
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<p class="text-gray-200 text-sm">CoWoP在AI服务器渗透率达<span class="text-cyan-300">30%</span>（当前<5%），mSAP PCB市场规模从<span class="text-cyan-300">50亿→200亿</span>。</p>
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</div>
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<div class="bg-slate-800/50 p-4 rounded-lg">
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<div class="font-semibold text-cyan-200 mb-1">2027+</div>
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<p class="text-gray-200 text-sm">玻璃基板（TGV）与mSAP工艺融合，推动<span class="text-cyan-300">CPU/GPU封装革命</span>。</p>
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</div>
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</div>
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</div>
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</div>
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</div>
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</div>
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<!-- 产业链与核心公司深度剖析 -->
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<div class="card card-gradient shadow-xl mb-10 rounded-xl overflow-hidden">
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<div class="p-6 md:p-8">
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<h2 class="text-2xl font-bold mb-6 section-title">产业链与核心公司深度剖析</h2>
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<div class="mb-6">
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<h3 class="text-xl font-semibold mb-4 text-cyan-300">产业链图谱</h3>
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<div class="flex flex-wrap gap-4 justify-center">
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<div class="bg-slate-800/50 p-4 rounded-lg text-center min-w-[150px]">
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<div class="text-cyan-300 font-semibold mb-2">上游</div>
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<div class="text-sm text-gray-200">DTH铜箔<br>Low-CTE电子布</div>
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<div class="text-xs text-cyan-200 mt-2">德福科技、铜冠铜箔<br>宏和科技、中材科技</div>
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</div>
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<div class="bg-slate-800/50 p-4 rounded-lg text-center min-w-[150px]">
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<div class="text-cyan-300 font-semibold mb-2">中游</div>
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<div class="text-sm text-gray-200">mSAP设备<br>PCB厂</div>
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<div class="text-xs text-cyan-200 mt-2">东威科技、大族数控<br>鹏鼎、深南、胜宏</div>
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</div>
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<div class="bg-slate-800/50 p-4 rounded-lg text-center min-w-[150px]">
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<div class="text-cyan-300 font-semibold mb-2">下游</div>
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<div class="text-sm text-gray-200">AI服务器<br>1.6T光模块<br>苹果折叠屏</div>
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<div class="text-xs text-cyan-200 mt-2">GB300<br>中际旭创等<br>苹果</div>
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</div>
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</div>
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</div>
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<div>
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<h3 class="text-xl font-semibold mb-4 text-cyan-300">核心玩家对比</h3>
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<div class="overflow-x-auto">
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<table class="w-full text-sm">
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<thead>
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<tr class="border-b border-slate-700">
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<th class="text-left p-3 text-cyan-300">公司</th>
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<th class="text-left p-3 text-cyan-300">角色</th>
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<th class="text-left p-3 text-cyan-300">进展</th>
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<th class="text-left p-3 text-cyan-300">风险</th>
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</tr>
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</thead>
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<tbody>
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<tr class="border-b border-slate-800">
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<td class="p-3 font-semibold text-cyan-200">鹏鼎控股</td>
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<td class="p-3">mSAP龙头</td>
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<td class="p-3">苹果SLP+GB300双驱动，2026年利润弹性<span class="text-cyan-300">15亿</span></td>
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<td class="p-3">苹果订单依赖度高</td>
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</tr>
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<tr class="border-b border-slate-800">
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<td class="p-3 font-semibold text-cyan-200">德福科技</td>
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<td class="p-3">DTH铜箔唯一国产</td>
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<td class="p-3">通过存储芯片龙头验证，<span class="text-cyan-300">三井替代</span></td>
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<td class="p-3">锂电铜箔转产竞争</td>
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</tr>
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<tr class="border-b border-slate-800">
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<td class="p-3 font-semibold text-cyan-200">东威科技</td>
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<td class="p-3">电镀设备垄断</td>
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<td class="p-3">MVCP设备市占率<span class="text-cyan-300">50%+</span>，订单创新高</td>
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<td class="p-3">东南亚扩产不及预期</td>
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</tr>
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<tr class="border-b border-slate-800">
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<td class="p-3 font-semibold text-cyan-200">胜宏科技</td>
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||
<td class="p-3">正交背板供应商</td>
|
||
<td class="p-3">GB300背板份额<span class="text-cyan-300">30%+</span></td>
|
||
<td class="p-3">技术路线被玻璃基板颠覆</td>
|
||
</tr>
|
||
</tbody>
|
||
</table>
|
||
</div>
|
||
</div>
|
||
</div>
|
||
</div>
|
||
|
||
<!-- 潜在风险与挑战 -->
|
||
<div class="card card-gradient shadow-xl mb-10 rounded-xl overflow-hidden">
|
||
<div class="p-6 md:p-8">
|
||
<h2 class="text-2xl font-bold mb-6 section-title">潜在风险与挑战</h2>
|
||
|
||
<div class="grid grid-cols-1 md:grid-cols-2 gap-6">
|
||
<div class="bg-slate-800/50 p-5 rounded-lg">
|
||
<h3 class="text-lg font-semibold mb-3 text-cyan-300 flex items-center">
|
||
<i class="fas fa-exclamation-triangle text-amber-400 mr-2"></i>
|
||
技术风险
|
||
</h3>
|
||
<p class="text-gray-200">mSAP良率仍低于传统HDI（<span class="text-cyan-300">60% vs 85%</span>），玻璃基板（TGV）可能替代。</p>
|
||
</div>
|
||
|
||
<div class="bg-slate-800/50 p-5 rounded-lg">
|
||
<h3 class="text-lg font-semibold mb-3 text-cyan-300 flex items-center">
|
||
<i class="fas fa-exclamation-triangle text-amber-400 mr-2"></i>
|
||
商业化风险
|
||
</h3>
|
||
<p class="text-gray-200">CoWoP需客户认证周期<span class="text-cyan-300">12-18个月</span>，短期放量存疑。</p>
|
||
</div>
|
||
|
||
<div class="bg-slate-800/50 p-5 rounded-lg">
|
||
<h3 class="text-lg font-semibold mb-3 text-cyan-300 flex items-center">
|
||
<i class="fas fa-exclamation-triangle text-amber-400 mr-2"></i>
|
||
竞争风险
|
||
</h3>
|
||
<p class="text-gray-200">日韩厂商（揖斐电、三星电机）加速扩产，<span class="text-cyan-300">价格战</span>可能重演。</p>
|
||
</div>
|
||
|
||
<div class="bg-slate-800/50 p-5 rounded-lg">
|
||
<h3 class="text-lg font-semibold mb-3 text-cyan-300 flex items-center">
|
||
<i class="fas fa-exclamation-triangle text-amber-400 mr-2"></i>
|
||
信息矛盾
|
||
</h3>
|
||
<p class="text-gray-200">新闻称"mSAP不是新工艺"，但研报强调"技术壁垒提升"，<span class="text-cyan-300">需跟踪订单验证</span>。</p>
|
||
</div>
|
||
</div>
|
||
</div>
|
||
</div>
|
||
|
||
<!-- 综合结论与投资启示 -->
|
||
<div class="card bg-gradient-to-r from-cyan-900/50 to-blue-900/50 shadow-xl mb-10 rounded-xl overflow-hidden border border-cyan-500/30">
|
||
<div class="p-6 md:p-8">
|
||
<h2 class="text-2xl font-bold mb-6 section-title">综合结论与投资启示</h2>
|
||
|
||
<div class="mb-6">
|
||
<h3 class="text-xl font-semibold mb-3 text-cyan-300">阶段判断</h3>
|
||
<p class="text-gray-200">mSAP处于<span class="text-cyan-300 font-semibold">主题炒作向基本面过渡</span>阶段，<span class="text-cyan-300 font-semibold">2025Q4订单兑现</span>是关键分水岭。</p>
|
||
</div>
|
||
|
||
<div class="mb-6">
|
||
<h3 class="text-xl font-semibold mb-3 text-cyan-300">投资方向</h3>
|
||
<div class="grid grid-cols-1 md:grid-cols-2 gap-4">
|
||
<div class="bg-slate-800/50 p-4 rounded-lg">
|
||
<div class="font-semibold text-cyan-200 mb-2">最纯标的</div>
|
||
<p class="text-gray-200 text-sm"><span class="text-cyan-300">德福科技</span>（DTH铜箔，<span class="text-cyan-300">90%三井替代空间</span>）+ <span class="text-cyan-300">东威科技</span>（设备垄断，<span class="text-cyan-300">订单弹性</span>）。</p>
|
||
</div>
|
||
<div class="bg-slate-800/50 p-4 rounded-lg">
|
||
<div class="font-semibold text-cyan-200 mb-2">弹性标的</div>
|
||
<p class="text-gray-200 text-sm"><span class="text-cyan-300">鹏鼎控股</span>（苹果+AI双轮驱动，<span class="text-cyan-300">估值未充分反映CoWoP增量</span>）。</p>
|
||
</div>
|
||
</div>
|
||
</div>
|
||
|
||
<div>
|
||
<h3 class="text-xl font-semibold mb-3 text-cyan-300">跟踪指标</h3>
|
||
<ol class="space-y-2">
|
||
<li class="flex items-start">
|
||
<span class="bg-cyan-500 text-slate-900 font-bold rounded-full w-6 h-6 flex items-center justify-center mr-3 flex-shrink-0">1</span>
|
||
<p class="text-gray-200"><span class="text-cyan-300">GB300服务器出货量</span>（2025Q4指引）。</p>
|
||
</li>
|
||
<li class="flex items-start">
|
||
<span class="bg-cyan-500 text-slate-900 font-bold rounded-full w-6 h-6 flex items-center justify-center mr-3 flex-shrink-0">2</span>
|
||
<p class="text-gray-200"><span class="text-cyan-300">德福科技载体铜箔月产能</span>（当前<span class="text-cyan-300">100吨/月</span>，目标<span class="text-cyan-300">500吨/月</span>）。</p>
|
||
</li>
|
||
<li class="flex items-start">
|
||
<span class="bg-cyan-500 text-slate-900 font-bold rounded-full w-6 h-6 flex items-center justify-center mr-3 flex-shrink-0">3</span>
|
||
<p class="text-gray-200"><span class="text-cyan-300">东威科技mSAP设备新签订单</span>（2025年H1需<span class="text-cyan-300">>10亿</span>支撑预期）。</p>
|
||
</li>
|
||
</ol>
|
||
</div>
|
||
|
||
<div class="mt-6 p-4 bg-cyan-900/30 rounded-lg border border-cyan-500/30">
|
||
<p class="text-center text-cyan-200 font-semibold">
|
||
结论：mSAP是AI硬件升级的"隐形冠军"，短期看订单，长期看工艺-材料闭环。优先布局<span class="text-cyan-300">上游材料</span>和<span class="text-cyan-300">设备</span>，警惕<span class="text-cyan-300">技术路线颠覆</span>。
|
||
</p>
|
||
</div>
|
||
</div>
|
||
</div>
|
||
|
||
<!-- 关联股票数据 -->
|
||
<div class="card card-gradient shadow-xl mb-10 rounded-xl overflow-hidden">
|
||
<div class="p-6 md:p-8">
|
||
<h2 class="text-2xl font-bold mb-6 section-title">关联股票数据</h2>
|
||
|
||
<div class="table-container">
|
||
<table class="w-full text-sm">
|
||
<thead>
|
||
<tr class="border-b border-slate-700">
|
||
<th class="text-left p-3 text-cyan-300">股票名称</th>
|
||
<th class="text-left p-3 text-cyan-300">项目</th>
|
||
<th class="text-left p-3 text-cyan-300">行业</th>
|
||
<th class="text-left p-3 text-cyan-300">产业链</th>
|
||
<th class="text-left p-3 text-cyan-300">原因</th>
|
||
</tr>
|
||
</thead>
|
||
<tbody>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/50 transition-colors">
|
||
<td class="p-3 font-semibold text-cyan-200">超声电子</td>
|
||
<td class="p-3">mSAP技术量产</td>
|
||
<td class="p-3">PCB制造</td>
|
||
<td class="p-3">PCB生产</td>
|
||
<td class="p-3">mSAP相应技术门槛有量产能力或已有储备开发</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/50 transition-colors">
|
||
<td class="p-3 font-semibold text-cyan-200">兴森科技</td>
|
||
<td class="p-3">减成法(Tenting)、半加成法(mSAP)、半加成法(SAP)</td>
|
||
<td class="p-3">PCB制造</td>
|
||
<td class="p-3">PCB生产</td>
|
||
<td class="p-3">已实现减成法、改良半加成法、半加成法等全技术领域覆盖</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/50 transition-colors">
|
||
<td class="p-3 font-semibold text-cyan-200">景旺电子</td>
|
||
<td class="p-3">珠一期工程项目</td>
|
||
<td class="p-3">PCB制造</td>
|
||
<td class="p-3">PCB生产</td>
|
||
<td class="p-3">建成后将形成60万平方米的HDI板（含mSAP技术）生产能力</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/50 transition-colors">
|
||
<td class="p-3 font-semibold text-cyan-200">胜宏科技</td>
|
||
<td class="p-3">2021年募投项目</td>
|
||
<td class="p-3">PCB制造</td>
|
||
<td class="p-3">PCB生产</td>
|
||
<td class="p-3">生产工艺采用半加成（mSAP）和全加成（SAP）法</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/50 transition-colors">
|
||
<td class="p-3 font-semibold text-cyan-200">生益科技</td>
|
||
<td class="p-3">埋线(ETS)工艺研发</td>
|
||
<td class="p-3">PCB材料</td>
|
||
<td class="p-3">PCB上游材料</td>
|
||
<td class="p-3">采用埋线工艺满足精细节距封装需求，在改良型半加成方法基础上实现更精细线路制作</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/50 transition-colors">
|
||
<td class="p-3 font-semibold text-cyan-200">崇达技术</td>
|
||
<td class="p-3">普诺威mSAP制程生产线</td>
|
||
<td class="p-3">PCB制造</td>
|
||
<td class="p-3">PCB生产</td>
|
||
<td class="p-3">子公司普诺威投资4亿元新建mSAP制程生产线</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/50 transition-colors">
|
||
<td class="p-3 font-semibold text-cyan-200">博敏电子</td>
|
||
<td class="p-3">细密线路mSAP工艺封装载板</td>
|
||
<td class="p-3">PCB制造</td>
|
||
<td class="p-3">PCB生产</td>
|
||
<td class="p-3">投资新增细密线路mSAP工艺封装载板，拥有成熟的mSAP工艺技术</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/50 transition-colors">
|
||
<td class="p-3 font-semibold text-cyan-200">中京电子</td>
|
||
<td class="p-3">mSAP工艺量产</td>
|
||
<td class="p-3">PCB制造</td>
|
||
<td class="p-3">PCB生产</td>
|
||
<td class="p-3">预计2024年Q2内形成mSAP工艺量产能力</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/50 transition-colors">
|
||
<td class="p-3 font-semibold text-cyan-200">方正科技</td>
|
||
<td class="p-3">mSAP特色工艺</td>
|
||
<td class="p-3">PCB制造</td>
|
||
<td class="p-3">PCB生产</td>
|
||
<td class="p-3">在mSAP等特色工艺方面已实现量产</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/50 transition-colors">
|
||
<td class="p-3 font-semibold text-cyan-200">深南电路</td>
|
||
<td class="p-3">FC-CSP封装基板</td>
|
||
<td class="p-3">PCB制造</td>
|
||
<td class="p-3">PCB生产</td>
|
||
<td class="p-3">2023年FC-CSP封装基板产品在mSAP和ETS工艺的样品能力已达到行业内领先水平</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/50 transition-colors">
|
||
<td class="p-3 font-semibold text-cyan-200">东山精密</td>
|
||
<td class="p-3">四层类载板产品</td>
|
||
<td class="p-3">PCB制造</td>
|
||
<td class="p-3">PCB生产</td>
|
||
<td class="p-3">项目采用mSAP工艺制作四层类载板产品</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/50 transition-colors">
|
||
<td class="p-3 font-semibold text-cyan-200">鹏鼎控股</td>
|
||
<td class="p-3">高阶HDI及SLP扩产</td>
|
||
<td class="p-3">PCB制造</td>
|
||
<td class="p-3">PCB生产</td>
|
||
<td class="p-3">年产526.75万平方英尺高阶HDI及SLP印刷电路板扩产项目与宏启胜项目产品均属于高阶HDI及基于mSAP工艺的SLP产品</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/50 transition-colors">
|
||
<td class="p-3 font-semibold text-cyan-200">方邦股份</td>
|
||
<td class="p-3">可剥铜材料</td>
|
||
<td class="p-3">铜箔制造</td>
|
||
<td class="p-3">PCB上游材料</td>
|
||
<td class="p-3">公司生产的可剥铜可满足mSAP的制程要求</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/50 transition-colors">
|
||
<td class="p-3 font-semibold text-cyan-200">东威科技</td>
|
||
<td class="p-3">MSAP移载式VCP设备及IC载板设备</td>
|
||
<td class="p-3">PCB设备</td>
|
||
<td class="p-3">PCB生产设备</td>
|
||
<td class="p-3">自主研发的MSAP移载式VCP设备及IC载板设备</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/50 transition-colors">
|
||
<td class="p-3 font-semibold text-cyan-200">芯碁微装</td>
|
||
<td class="p-3">MAS6P系列设备</td>
|
||
<td class="p-3">PCB设备</td>
|
||
<td class="p-3">PCB生产设备</td>
|
||
<td class="p-3">MAS6P系列已成功应用于高阶HDI（含mSAP）及IC载板量产</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/50 transition-colors">
|
||
<td class="p-3 font-semibold text-cyan-200">大族数控</td>
|
||
<td class="p-3">mSAP3.0工艺技术</td>
|
||
<td class="p-3">PCB设备</td>
|
||
<td class="p-3">PCB生产设备</td>
|
||
<td class="p-3">积极储备mSAP3.0工艺技术</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/50 transition-colors">
|
||
<td class="p-3 font-semibold text-cyan-200">光华科技</td>
|
||
<td class="p-3">mSAP化学镀铜</td>
|
||
<td class="p-3">化学品制造</td>
|
||
<td class="p-3">PCB上游材料</td>
|
||
<td class="p-3">封装基板的制造中全面布局了相关的湿电子化学品，如mSAP化学镀铜</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/50 transition-colors">
|
||
<td class="p-3 font-semibold text-cyan-200">三孚新科</td>
|
||
<td class="p-3">mSAP低线路圆弧率填盲孔电镀添加剂</td>
|
||
<td class="p-3">化学品制造</td>
|
||
<td class="p-3">PCB上游材料</td>
|
||
<td class="p-3">在研项目涉及mSAP低线路圆弧率填盲孔电镀添加剂</td>
|
||
</tr>
|
||
</tbody>
|
||
</table>
|
||
</div>
|
||
</div>
|
||
</div>
|
||
</div>
|
||
|
||
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<script src="https://cdn.jsdelivr.net/npm/tsparticles@3/tsparticles.bundle.min.js"></script>
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<script>
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|
||
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|
||
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|
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},
|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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enable: true,
|
||
mode: "grab"
|
||
},
|
||
onclick: {
|
||
enable: true,
|
||
mode: "push"
|
||
},
|
||
resize: true
|
||
},
|
||
modes: {
|
||
grab: {
|
||
distance: 140,
|
||
line_linked: {
|
||
opacity: 1
|
||
}
|
||
},
|
||
push: {
|
||
particles_nb: 4
|
||
}
|
||
}
|
||
},
|
||
retina_detect: true
|
||
});
|
||
</script>
|
||
</body>
|
||
</html>
|
||
``` |