498 lines
34 KiB
HTML
498 lines
34 KiB
HTML
<!DOCTYPE html>
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<html lang="zh-CN" data-theme="night">
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<head>
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<meta charset="UTF-8">
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<meta name="viewport" content="width=device-width, initial-scale=1.0">
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<title>阿里AI芯片 - 深度行研报告</title>
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<script src="https://cdn.tailwindcss.com"></script>
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<link href="https://cdn.jsdelivr.net/npm/daisyui@4.10.1/dist/full.min.css" rel="stylesheet" type="text/css" />
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@import url('https://fonts.googleapis.com/css2?family=Inter:wght@300;400;500;600;700&family=Orbitron:wght@400;700&display=swap');
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body {
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font-family: 'Inter', sans-serif;
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background-color: #000000;
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background-image:
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radial-gradient(ellipse at 20% 20%, rgba(55, 8, 122, 0.3) 0%, transparent 50%),
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</head>
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<body class="min-h-screen">
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<header class="sticky top-0 z-50 p-4 glass-card rounded-b-2xl shadow-lg">
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<div class="container mx-auto flex justify-between items-center">
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<div class="text-lg font-bold fui-title text-cyan-300">
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价小前投研
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</div>
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<div class="text-xs text-gray-400 text-right">
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<p>北京价值前沿科技有限公司 AI投研agent呈现</p>
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<p>本报告为AI合成数据，投资需谨慎</p>
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</div>
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</div>
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</header>
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<main class="container mx-auto p-4 lg:p-8">
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<!-- Hero Section -->
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<section class="text-center my-8 lg:my-16">
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<h1 class="text-5xl md:text-7xl font-bold fui-title bg-clip-text text-transparent bg-gradient-to-br from-cyan-300 to-purple-400 mb-4 animate-pulse">
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阿里AI芯片
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</h1>
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<p class="text-lg text-gray-300 max-w-4xl mx-auto">
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在地缘政治倒逼与内生AI业务爆发的双重驱动下，阿里巴巴以巨额资本开支为燃料，加速其“自研AI芯片+国产化供应链”战略落地。概念正从宏大叙事转向产业链订单兑现的初期阶段。
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</p>
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</section>
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<!-- Capital Expenditure Chart -->
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<section class="my-12">
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<div class="glass-card rounded-2xl p-6">
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<h2 class="text-2xl font-bold mb-4 fui-title text-cyan-300">资本开支计划 & AI芯片投入</h2>
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<div id="capexChart" style="width: 100%; height: 400px;"></div>
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</div>
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</section>
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<!-- Insight Section (Bento Grid) -->
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<section class="my-12">
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<h2 class="text-4xl font-bold fui-title text-center mb-8">概念深度解析 (Insight)</h2>
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<div class="bento-grid">
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<div class="glass-card rounded-2xl p-6 lg:grid-col-span-2 lg:grid-row-span-2">
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<h3 class="text-xl font-bold mb-4 fui-title text-cyan-300">核心观点与市场逻辑</h3>
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<div class="space-y-4 text-gray-300 text-sm">
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<p><strong class="text-cyan-400">核心驱动力:</strong></p>
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<ul class="list-disc list-inside pl-4 space-y-2">
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<li><strong>供应链安全 (地缘政治驱动):</strong> 应对Nvidia禁令，保障AI战略不被“卡脖子”是首要背景。采用国内代工的“B计划”是必然选择。</li>
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<li><strong>成本控制 (商业经济驱动):</strong> 集团推理需求呈“指数级上升”，自研ASIC芯片相比通用GPU在特定场景具备更高能效比和更低单位成本，是实现AI商业模式的关键。</li>
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<li><strong>软硬协同 (技术战略驱动):</strong> 阿里云核心竞争力是“自研芯片+模型能力”。为“通义千问”定制芯片架构，可实现外购通用芯片无法比拟的最佳运行效率。</li>
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</ul>
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<div class="glow-divider my-4"></div>
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<p><strong class="text-cyan-400">市场热度与预期差:</strong></p>
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<ul class="list-disc list-inside pl-4 space-y-2">
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<li><strong>市场情绪:</strong> 高度乐观，聚焦于3800亿宏大投资叙事和“国产替代”蓝图，相关产业链公司股价已充分反应。</li>
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<li><strong>预期差 1 - “自研”非“全替”:</strong> 市场倾向于解读为全面替代，但实际上阿里策略是“广泛采购+部分自研”，自研芯片主要定位“云端推理”，不会实质性影响对海光、寒武纪等的有限采购。</li>
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<li><strong>预期差 2 - 技术挑战认知不足:</strong> 市场对标H100感到兴奋，但忽略了采用大陆N+1节点工艺带来的功耗(提升1-2倍)和面积(增大50-70%)代价，实际综合成本和性能表现仍是未知数。</li>
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<li><strong>预期差 3 - 受益环节认知模糊:</strong> 市场情绪易扩散，但核心受益环节高度聚焦于因功耗倍增而需求暴涨的<strong class="text-white">液冷、电源</strong>，以及国产化直接利好的<strong class="text-white">IP和测试</strong>环节。</li>
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</ul>
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</div>
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</div>
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<div class="glass-card rounded-2xl p-6">
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<h3 class="text-xl font-bold mb-4 fui-title text-cyan-300">关键催化剂</h3>
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<div class="space-y-3 text-gray-300 text-sm">
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<p class="font-semibold text-cyan-400">近期 (3-6个月)</p>
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<ul class="list-decimal list-inside space-y-1">
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<li>阿里季度财报验证资本开支(Capex)执行情况。</li>
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<li>新一代AI ASIC芯片正式发布，披露性能参数与合作细节。</li>
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<li>与苹果合作的算力采购规模或适配计划进一步披露。</li>
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<li>核心供应链厂商（如利扬芯片）业绩出现显著增长。</li>
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</ul>
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<p class="font-semibold text-cyan-400 pt-2">长期发展路径</p>
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<ul class="list-decimal list-inside space-y-1">
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<li><strong>当前-2026:</strong> 内部消化与基建。完成芯片量产与内部部署。</li>
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<li><strong>2026-2028:</strong> 生态外溢。向生态伙伴输出解决方案。</li>
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<li><strong>2028+:</strong> 端云一体化。形成云、端、OS的生态闭环。</li>
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</ul>
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</div>
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</div>
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<div class="glass-card rounded-2xl p-6">
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<h3 class="text-xl font-bold mb-4 fui-title text-red-400">潜在风险与挑战</h3>
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<div class="space-y-3 text-gray-300 text-sm">
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<p><strong class="text-red-400">技术风险:</strong> N+1工艺瓶颈带来的功耗和面积问题是最大风险，可能影响芯片的经济性；RISC-V生态在高算力领域成熟度仍有差距。</p>
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<p><strong class="text-red-400">商业化风险:</strong> 自研投入巨大，若最终TCO无法优于外购，商业逻辑将受挑战；AI业务需求波动可能影响投资计划。</p>
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<p><strong class="text-red-400">信息交叉验证风险:</strong>
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<span class="font-bold text-white">关于新一代芯片功耗，不同路演信息存在显著矛盾</span>
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(一份称“功耗提升1-2倍”，另一份称“功耗仅H20几分之一”)，暴露了关键性能指标的高度不确定性，是核心警惕点。</p>
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</div>
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</div>
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<div class="glass-card rounded-2xl p-6 lg:grid-col-span-3">
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<h3 class="text-xl font-bold mb-4 fui-title text-cyan-300">产业链深度剖析</h3>
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<div class="grid grid-cols-1 md:grid-cols-3 gap-6 text-sm text-gray-300">
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<div>
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<h4 class="font-semibold text-cyan-400 mb-2">上游 (基础技术与制造)</h4>
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<ul class="list-disc list-inside space-y-1">
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<li><strong>IP授权:</strong> 芯原股份 (IP), 全志科技 (RISC-V生态)</li>
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<li><strong>芯片代工:</strong> 中芯国际, 华虹公司 (潜在N+1节点合作方)</li>
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<li><strong>设备/材料:</strong> 相关半导体设备公司</li>
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</ul>
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</div>
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<div>
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<h4 class="font-semibold text-cyan-400 mb-2">中游 (芯片设计与支持)</h4>
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<ul class="list-disc list-inside space-y-1">
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<li><strong>芯片设计:</strong> 阿里平头哥 (核心主体)</li>
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<li><strong>芯片测试:</strong> <strong class="text-white">利扬芯片 (核心测试伙伴)</strong></li>
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<li><strong>封装:</strong> 山子高科 (间接提供)</li>
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</ul>
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</div>
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<div>
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<h4 class="font-semibold text-cyan-400 mb-2">下游 (基础设施与应用)</h4>
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<ul class="list-disc list-inside space-y-1">
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<li><strong>散热 (液冷):</strong> <strong class="text-white">思泉新材 (定制液冷机柜)</strong></li>
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<li><strong>服务器互联:</strong> <strong class="text-white">华工科技 (核心光模块)</strong>, 万通发展 (PCIe交换芯片)</li>
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<li><strong>IDC与电源:</strong> 数据港 (核心IDC供应商)</li>
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</ul>
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</div>
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</div>
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<div class="glow-divider my-4"></div>
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<h4 class="font-semibold text-cyan-400 mb-2">核心玩家对比 & 投资启示</h4>
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<p class="text-sm">
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当前阶段，最具投资价值的并非遥远的芯片成功本身，而是由阿里资本开支带来的、确定性最高的“卖铲人”环节：
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<br><strong>1. AI基础设施硬件:</strong> 特别是应对高功耗需求的<strong class="text-white">液冷散热 (思泉新材)</strong>和保障数据传输的<strong class="text-white">高速光模块 (华工科技)</strong>。
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<br><strong>2. 国产化核心外包服务:</strong> 如<strong class="text-white">芯片测试 (利扬芯片)</strong>，其与平头哥的合作关系已得到多方确认，逻辑清晰且纯粹。
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</p>
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<p class="text-sm mt-2">
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<strong class="text-cyan-400">需重点跟踪指标:</strong> 阿里季度<strong class="text-white">Capex</strong>、核心供应商<strong class="text-white">订单</strong>、平头哥官方芯片<strong class="text-white">性能发布</strong>、阿里云AI业务<strong class="text-white">收入增速</strong>。
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</p>
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</div>
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</div>
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</section>
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<!-- Detailed Data Tabs -->
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<section class="my-12" x-data="{ tab: 'news' }">
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<h2 class="text-4xl font-bold fui-title text-center mb-8">原始情报汇总</h2>
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<div class="tabs tabs-boxed justify-center glass-card max-w-2xl mx-auto">
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<a class="tab" :class="{ 'tab-active': tab === 'news' }" @click.prevent="tab = 'news'">新闻数据</a>
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<a class="tab" :class="{ 'tab-active': tab === 'roadshow' }" @click.prevent="tab = 'roadshow'">路演纪要</a>
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<a class="tab" :class="{ 'tab-active': tab === 'report' }" @click.prevent="tab = 'report'">研报精粹</a>
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</div>
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<div class="mt-6">
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<!-- News Data -->
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<div x-show="tab === 'news'" class="glass-card rounded-2xl p-6 space-y-4">
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<div>
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<h4 class="font-bold text-lg text-cyan-400">一、 阿里自研AI芯片（平头哥）</h4>
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<ul class="list-disc list-inside text-sm text-gray-300 mt-2 space-y-1">
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<li><strong>芯片类型与部署:</strong> PPU芯片已规划化部署(需液冷)；CIPU 2.0芯片用于磐久服务器；平头哥自研算力芯片在阿里自用。</li>
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<li><strong>研发与量产:</strong> 受限于需求及先进制程供给，尚未放量。25年有望随阿里资本开支上修而推进。</li>
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<li><strong>产业链合作:</strong> <strong class="text-white">利扬芯片</strong>为重要芯片测试伙伴，测试需求有望达小十亿量级；<strong class="text-white">思泉新材</strong>为PPU定制浸没式液冷机柜，预计26年液冷板批量出货。</li>
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</ul>
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</div>
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<div class="glow-divider"></div>
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<div>
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<h4 class="font-bold text-lg text-cyan-400">二、 阿里AI产品采用的第三方芯片</h4>
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<ul class="list-disc list-inside text-sm text-gray-300 mt-2 space-y-1">
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<li><strong>夸克AI眼镜:</strong> 采用高通AR1 + <strong class="text-white">恒玄科技BES2800</strong>双芯设计，并采用<strong class="text-white">南芯科技</strong>电源芯片解决方案。</li>
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</ul>
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</div>
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<div class="glow-divider"></div>
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<div>
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<h4 class="font-bold text-lg text-cyan-400">三、 资本开支与市场影响</h4>
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<ul class="list-disc list-inside text-sm text-gray-300 mt-2 space-y-1">
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<li><strong>投入定调:</strong> 阿里业绩会定调AI投入“不设上限”，未来三年3800亿元人民币投资计划不变。</li>
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<li><strong>具体数据:</strong> CY24资本开支800+亿元，CY25资本开支1100+亿元，AI芯片目前资本开支400+亿元。</li>
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<li><strong>市场影响:</strong> 阿里加大AI投入，市场情绪高涨，芯片产业链上下游全面大涨。</li>
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</ul>
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</div>
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</div>
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<!-- Roadshow Data -->
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<div x-show="tab === 'roadshow'" class="glass-card rounded-2xl p-6 space-y-4" style="display: none;">
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<div>
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<h4 class="font-bold text-lg text-cyan-400">一、 自研AI芯片概况、定位与战略</h4>
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<ul class="list-disc list-inside text-sm text-gray-300 mt-2 space-y-1">
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<li><strong>核心定位:</strong> 新一代AI推理芯片（自研AI ASIC），用于云端推理，旨在降低算力成本。</li>
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<li><strong>战略动机:</strong> 应对英伟达禁令，寻求国产替代；软硬协同降低推理成本。</li>
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</ul>
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</div>
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<div class="glow-divider"></div>
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<div>
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<h4 class="font-bold text-lg text-cyan-400">二、 具体芯片型号、性能与技术规格</h4>
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<ul class="list-disc list-inside text-sm text-gray-300 mt-2 space-y-1">
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<li><strong>型号:</strong> 含光800 (12nm), 含光900 (7nm), 倚天710。</li>
|
||
<li><strong>新一代性能:</strong> 纸面算力对标NVIDIA H100，实际算力因效率差异约为H100的1.5-2倍；另一说法是对标H20。</li>
|
||
<li><strong>功耗与工艺:</strong> <strong class="text-red-400">存在矛盾信息。</strong> 一方面，采用大陆代工厂N+1节点，较台积电N5功耗提升1-2倍；另一方面，称对标H20的ASIC功耗仅为H20几分之一。</li>
|
||
</ul>
|
||
</div>
|
||
<div class="glow-divider"></div>
|
||
<div>
|
||
<h4 class="font-bold text-lg text-cyan-400">三、 量产与部署计划</h4>
|
||
<ul class="list-disc list-inside text-sm text-gray-300 mt-2 space-y-1">
|
||
<li><strong>核心进程:</strong> 本次重点是“工艺国产化与产能落地”。</li>
|
||
<li><strong>出货预期:</strong> 有望在<strong class="text-white">2026年</strong>快速放大。</li>
|
||
</ul>
|
||
</div>
|
||
</div>
|
||
|
||
<!-- Report Data -->
|
||
<div x-show="tab === 'report'" class="glass-card rounded-2xl p-6 space-y-4" style="display: none;">
|
||
<div>
|
||
<h4 class="font-bold text-lg text-cyan-400">一、 自研AI芯片布局（平头哥）</h4>
|
||
<ul class="list-disc list-inside text-sm text-gray-300 mt-2 space-y-1">
|
||
<li><strong>核心竞争力:</strong> “阿里云AI的核心竞争力是自研芯片+模型能力”，平头哥布局形成成本优势。</li>
|
||
<li><strong>战略作用:</strong> 降低AI算力成本，支撑AI产品规模化应用；通过差异化技术应对竞争。</li>
|
||
<li><strong>产品矩阵:</strong> 含光800 (AI推理), 倚天710 (CPU)，已实现量产出货。</li>
|
||
</ul>
|
||
</div>
|
||
<div class="glow-divider"></div>
|
||
<div>
|
||
<h4 class="font-bold text-lg text-cyan-400">二、 AI基础设施投入与算力建设</h4>
|
||
<ul class="list-disc list-inside text-sm text-gray-300 mt-2 space-y-1">
|
||
<li><strong>总投资:</strong> 未来三年投入超<strong class="text-white">3800亿元</strong>用于建设云和AI硬件基础设施。</li>
|
||
<li><strong>国产适配:</strong> 2024年已完成对昇腾、寒武纪等国产芯片的适配。</li>
|
||
</ul>
|
||
</div>
|
||
<div class="glow-divider"></div>
|
||
<div>
|
||
<h4 class="font-bold text-lg text-cyan-400">三、 业务协同与生态应用</h4>
|
||
<ul class="list-disc list-inside text-sm text-gray-300 mt-2 space-y-1">
|
||
<li><strong>云业务增长:</strong> AI相关产品收入持续“三位数同比增长”，成为核心驱动力。</li>
|
||
<li><strong>端侧合作:</strong> 与传音控股合作提供端侧AI模型；与<strong class="text-white">苹果</strong>合作开发中国版AI功能。</li>
|
||
<li><strong>客户案例:</strong> 小鹏汽车自动驾驶、小米智能座舱等均基于阿里云AI芯片+大模型的组合。</li>
|
||
</ul>
|
||
</div>
|
||
</div>
|
||
</div>
|
||
</section>
|
||
|
||
<!-- Stock Data Section -->
|
||
<section class="my-12">
|
||
<h2 class="text-4xl font-bold fui-title text-center mb-8">相关产业链公司</h2>
|
||
|
||
<!-- Rise Analysis -->
|
||
<div class="mb-12">
|
||
<h3 class="text-2xl font-bold mb-6 fui-title text-cyan-300">涨幅异动分析</h3>
|
||
<div class="grid grid-cols-1 md:grid-cols-2 lg:grid-cols-3 gap-6">
|
||
<div class="glass-card rounded-2xl p-4 text-xs">
|
||
<div class="flex justify-between items-center mb-2">
|
||
<span class="font-bold text-lg text-white">华工科技 (000988)</span>
|
||
<span class="badge badge-success badge-outline">+6.24% (2025-08-29)</span>
|
||
</div>
|
||
<p class="text-gray-300"><strong>核心逻辑:</strong> 阿里光模块核心供应商地位被市场重新认知。已实现800G光模块规模化量产，在阿里自研AI芯片配套光互联方案中占据核心地位，深度绑定受益。</p>
|
||
</div>
|
||
<div class="glass-card rounded-2xl p-4 text-xs">
|
||
<div class="flex justify-between items-center mb-2">
|
||
<span class="font-bold text-lg text-white">万通发展 (600246)</span>
|
||
<span class="badge badge-success badge-outline">+10.02% (2025-09-01)</span>
|
||
</div>
|
||
<p class="text-gray-300"><strong>核心逻辑:</strong> 阿里AI芯片国产代工需求爆发，其控股子公司数渡科技PCIe5.0交换芯片已获阿里服务器生态链小批量订单，形成直接受益预期。</p>
|
||
</div>
|
||
<div class="glass-card rounded-2xl p-4 text-xs">
|
||
<div class="flex justify-between items-center mb-2">
|
||
<span class="font-bold text-lg text-white">山子高科 (000981)</span>
|
||
<span class="badge badge-success badge-outline">+9.92% (2025-09-12)</span>
|
||
</div>
|
||
<p class="text-gray-300"><strong>核心逻辑:</strong> 通过控股康强电子间接为阿里通义芯片提供封装测试，康强电子半年报已确认阿里订单放量，博弈阿里AI芯片本土化封测预期。</p>
|
||
</div>
|
||
<div class="glass-card rounded-2xl p-4 text-xs">
|
||
<div class="flex justify-between items-center mb-2">
|
||
<span class="font-bold text-lg text-white">寒武纪 (688256)</span>
|
||
<span class="badge badge-error badge-outline">+20.0% (2025-08-12)</span>
|
||
</div>
|
||
<p class="text-gray-300"><strong>核心逻辑(注意修正):</strong> 市场一度因国产替代逻辑炒作其受益于阿里等大厂采购。但路演纪要明确指出，阿里自研芯片对其“预期无实质影响”，需审慎甄别。</p>
|
||
</div>
|
||
<div class="glass-card rounded-2xl p-4 text-xs">
|
||
<div class="flex justify-between items-center mb-2">
|
||
<span class="font-bold text-lg text-white">数据港 (603881)</span>
|
||
<span class="badge badge-success badge-outline">+9.99% (2025-11-13)</span>
|
||
</div>
|
||
<p class="text-gray-300"><strong>核心逻辑:</strong> 阿里系唯一已批量交付液冷GPU机房的A股IDC标的。其新建项目默认配套液冷，可承载大模型训练集群需求，深度绑定阿里AI基建。</p>
|
||
</div>
|
||
<div class="glass-card rounded-2xl p-4 text-xs">
|
||
<div class="flex justify-between items-center mb-2">
|
||
<span class="font-bold text-lg text-white">天普股份 (605255)</span>
|
||
<span class="badge badge-success badge-outline">+10.0% (2025-09-01)</span>
|
||
</div>
|
||
<p class="text-gray-300"><strong>核心逻辑:</strong> 中昊芯英拟控股并注入AI芯片资产，而中昊芯英是国内唯一能量产TPU级训练芯片并供货阿里平头哥的公司，形成借壳+阿里生态双重预期。</p>
|
||
</div>
|
||
</div>
|
||
</div>
|
||
|
||
<!-- Stock Table -->
|
||
<div class="glass-card rounded-2xl p-1 overflow-x-auto">
|
||
<table class="table table-sm">
|
||
<thead>
|
||
<tr>
|
||
<th>股票名称</th>
|
||
<th>股票代码</th>
|
||
<th>关联原因</th>
|
||
<th>其他标签</th>
|
||
</tr>
|
||
</thead>
|
||
<tbody>
|
||
<tr><td>利扬芯片</td><td><a href="https://valuefrontier.cn/company?scode=688135" target="_blank" class="link link-hover text-cyan-400">688135</a></td><td>公司系平头哥供应商，提供AI芯片测试方案。</td><td><div class="badge badge-primary">阿里平头哥</div> <div class="badge badge-secondary">核心测试</div></td></tr>
|
||
<tr><td>芯原股份</td><td><a href="https://valuefrontier.cn/company?scode=688521" target="_blank" class="link link-hover text-cyan-400">688521</a></td><td>服务的公司包括阿里巴巴，提供芯片设计服务(IP)。</td><td><div class="badge badge-primary">芯片设计服务</div> <div class="badge badge-secondary">RISC-V 专利联盟</div></td></tr>
|
||
<tr><td>全志科技</td><td><a href="https://valuefrontier.cn/company?scode=300458" target="_blank" class="link link-hover text-cyan-400">300458</a></td><td>公司已基于平头哥RISC-V内核开发了多款芯片产品并实现量产。</td><td><div class="badge badge-primary">阿里平头哥</div> <div class="badge badge-secondary">玄铁优选</div></td></tr>
|
||
<tr><td>润和软件</td><td><a href="https://valuefrontier.cn/company?scode=300339" target="_blank" class="link link-hover text-cyan-400">300339</a></td><td>HiHope芯片全栈解决方案平台合作伙伴包括阿里平头哥。荣获“玄铁优选伙伴”奖。</td><td><div class="badge badge-primary">阿里平头哥</div> <div class="badge badge-secondary">玄铁优选</div></td></tr>
|
||
<tr><td>南芯科技</td><td><a href="https://valuefrontier.cn/company?scode=688484" target="_blank" class="link link-hover text-cyan-400">688484</a></td><td>平头哥技术授权；为阿里“夸克AI眼镜”提供电源芯片。</td><td><div class="badge badge-primary">阿里平头哥</div> <div class="badge badge-secondary">端侧生态</div></td></tr>
|
||
<tr><td>中芯国际</td><td><a href="https://valuefrontier.cn/company?scode=688981" target="_blank" class="link link-hover text-cyan-400">688981</a></td><td>国内晶圆代工龙头，路演提及“大陆代工厂N+1节点”的潜在合作方。</td><td><div class="badge badge-primary">潜在芯片代工</div></td></tr>
|
||
<tr><td>华虹公司</td><td><a href="https://valuefrontier.cn/company?scode=688347" target="_blank" class="link link-hover text-cyan-400">688347</a></td><td>国内特色工艺晶圆代工龙头，路演提及的潜在代工厂。</td><td><div class="badge badge-primary">潜在芯片代工</div></td></tr>
|
||
<tr><td>云天励飞</td><td><a href="https://valuefrontier.cn/company?scode=688343" target="_blank" class="link link-hover text-cyan-400">688343</a></td><td>公司AI芯片业务与平头哥建立了合作关系。</td><td><div class="badge badge-primary">阿里平头哥</div></td></tr>
|
||
<tr><td>纳思达</td><td><a href="https://valuefrontier.cn/company?scode=002180" target="_blank" class="link link-hover text-cyan-400">002180</a></td><td>深度合作平头哥，基于玄铁CPU设计的芯片重点应用在打印机主控SoC。</td><td><div class="badge badge-primary">阿里平头哥</div></td></tr>
|
||
<tr><td>香农芯创</td><td><a href="https://valuefrontier.cn/company?scode=300475" target="_blank" class="link link-hover text-cyan-400">300475</a></td><td>全资子公司2019-2021年第一大客户为阿里巴巴（含平头哥）。</td><td><div class="badge badge-primary">阿里平头哥</div></td></tr>
|
||
<tr><td>中国移动</td><td><a href="https://valuefrontier.cn/company?scode=600941" target="_blank" class="link link-hover text-cyan-400">600941</a></td><td>无剑联盟成员。</td><td><div class="badge badge-secondary">阿里 RISC-V</div> <div class="badge">无剑联盟</div></td></tr>
|
||
<tr><td>北京君正</td><td><a href="https://valuefrontier.cn/company?scode=300223" target="_blank" class="link link-hover text-cyan-400">300223</a></td><td>RISC-V专利联盟副理事长单位。</td><td><div class="badge badge-secondary">RISC-V 专利联盟</div></td></tr>
|
||
</tbody>
|
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</table>
|
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</div>
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