695 lines
31 KiB
HTML
695 lines
31 KiB
HTML
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<!DOCTYPE html>
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<meta charset="utf-8" />
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<meta name="viewport" content="width=device-width, initial-scale=1, shrink-to-fit=no">
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<title>半导体混合键合技术 - 行业洞察报告</title>
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</style>
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</head>
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<body>
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<div id="particles-js" class="particles-container"></div>
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<div class="container mx-auto px-4 py-8 max-w-7xl">
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<!-- 标题部分 -->
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<div class="text-center mb-12">
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<h1 class="text-4xl md:text-5xl font-bold text-white mb-4">
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<span class="highlight-text">半导体混合键合技术</span> 行业洞察报告
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</h1>
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<p class="text-gray-300 text-lg max-w-3xl mx-auto">
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深度解析混合键合技术在HBM4、3D NAND等领域的应用前景与投资机会
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</p>
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</div>
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<!-- 概念事件 -->
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<div class="tech-card rounded-xl p-6 mb-8">
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<div class="flex items-center mb-4">
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<i class="fas fa-bolt text-blue-500 text-2xl mr-3"></i>
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<h2 class="text-2xl font-bold text-white">概念事件</h2>
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</div>
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<div class="grid grid-cols-1 md:grid-cols-2 gap-6">
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<div>
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<h3 class="text-lg font-semibold text-blue-400 mb-3">背景与催化事件</h3>
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<ul class="space-y-2 text-gray-300">
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<li class="flex items-start">
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<span class="text-blue-500 mr-2">•</span>
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<span><strong>2024年11月</strong>：华为取得"混合键合结构及方法"专利，技术路径锁定HBM封装</span>
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</li>
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<li class="flex items-start">
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<span class="text-blue-500 mr-2">•</span>
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<span><strong>2025年2月</strong>：三星确认V10 NAND采用长江存储Xtacking混合键合技术，授权协议落地</span>
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</li>
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<li class="flex items-start">
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<span class="text-blue-500 mr-2">•</span>
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<span><strong>2025年3月</strong>：东吴机械、中银电子等机构密集发布研报，预测<strong>2030年混合键合设备市场规模达200亿元人民币</strong></span>
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</li>
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</ul>
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</div>
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<div>
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<h3 class="text-lg font-semibold text-blue-400 mb-3">技术发展时间轴</h3>
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<div class="space-y-4">
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<div class="timeline-item flex">
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<div class="timeline-dot mr-4 mt-1"></div>
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<div>
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<p class="text-white font-medium">2016年</p>
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<p class="text-gray-400 text-sm">长江存储启动混合键合研发（Xtacking 1.0）</p>
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</div>
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</div>
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<div class="timeline-item flex">
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<div class="timeline-dot mr-4 mt-1"></div>
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<div>
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<p class="text-white font-medium">2025年</p>
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<p class="text-gray-400 text-sm">Xtacking 5.0完成开发，三星/海力士导入量产</p>
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</div>
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</div>
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<div class="timeline-item flex">
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<div class="timeline-dot mr-4 mt-1"></div>
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<div>
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<p class="text-white font-medium">2026-2030年</p>
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<p class="text-gray-400 text-sm">HBM4/5、3D NAND、AI芯片全面渗透</p>
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</div>
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</div>
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</div>
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</div>
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</div>
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</div>
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<!-- 核心观点摘要 -->
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<div class="tech-card rounded-xl p-6 mb-8">
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<div class="flex items-center mb-4">
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<i class="fas fa-lightbulb text-yellow-500 text-2xl mr-3"></i>
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<h2 class="text-2xl font-bold text-white">核心观点摘要</h2>
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</div>
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<div class="grid grid-cols-1 md:grid-cols-3 gap-6">
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<div class="bg-gradient-to-br from-blue-900/50 to-blue-800/30 rounded-lg p-5 border border-blue-700/30">
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<div class="text-blue-400 text-4xl mb-3">
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<i class="fas fa-chart-line"></i>
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</div>
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<h3 class="text-lg font-semibold text-white mb-2">阶段判断</h3>
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<p class="text-gray-300 text-sm">混合键合技术已从<strong>实验室验证</strong>进入<strong>产业化爆发前夜</strong>，HBM4和3D NAND是核心落地场景</p>
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</div>
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<div class="bg-gradient-to-br from-purple-900/50 to-purple-800/30 rounded-lg p-5 border border-purple-700/30">
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<div class="text-purple-400 text-4xl mb-3">
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<i class="fas fa-rocket"></i>
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</div>
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<h3 class="text-lg font-semibold text-white mb-2">核心驱动力</h3>
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<p class="text-gray-300 text-sm">AI算力需求倒逼存储芯片堆叠层数增加，传统键合技术逼近物理极限，混合键合成为唯一解</p>
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</div>
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<div class="bg-gradient-to-br from-green-900/50 to-green-800/30 rounded-lg p-5 border border-green-700/30">
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<div class="text-green-400 text-4xl mb-3">
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<i class="fas fa-coins"></i>
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</div>
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<h3 class="text-lg font-semibold text-white mb-2">未来潜力</h3>
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<p class="text-gray-300 text-sm"><strong>2030年全球设备市场200亿元</strong>（CAGR 69%），国产替代空间巨大（当前国产化率<5%）</p>
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</div>
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</div>
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</div>
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<!-- 核心逻辑与市场认知分析 -->
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<div class="tech-card rounded-xl p-6 mb-8">
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<div class="flex items-center mb-4">
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<i class="fas fa-brain text-purple-500 text-2xl mr-3"></i>
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<h2 class="text-2xl font-bold text-white">核心逻辑与市场认知分析</h2>
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</div>
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<div class="grid grid-cols-1 md:grid-cols-2 gap-6">
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<div>
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<h3 class="text-lg font-semibold text-purple-400 mb-3">核心驱动力</h3>
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<div class="space-y-4">
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<div class="bg-slate-800/50 rounded-lg p-4">
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<h4 class="text-white font-medium mb-2">技术刚性需求</h4>
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<ul class="text-gray-300 text-sm space-y-1">
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<li>• HBM4要求<strong>I/O密度提升15倍</strong>（间距<2μm），传统微凸块无法满足</li>
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<li>• 混合键合可实现<strong>0.5-0.1μm间距</strong></li>
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<li>• 三星V10 NAND需<strong>420-430层堆叠</strong>，Xtacking技术良率提升20%</li>
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</ul>
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</div>
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<div class="bg-slate-800/50 rounded-lg p-4">
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<h4 class="text-white font-medium mb-2">政策与供应链安全</h4>
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<p class="text-gray-300 text-sm">美国对华HBM技术管制（2024年12月BIS新规），加速国产设备验证</p>
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</div>
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</div>
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</div>
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<div>
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<h3 class="text-lg font-semibold text-purple-400 mb-3">市场热度与预期差</h3>
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<div class="space-y-4">
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<div class="bg-slate-800/50 rounded-lg p-4">
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<h4 class="text-white font-medium mb-2">市场热度</h4>
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<ul class="text-gray-300 text-sm space-y-1">
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<li>• 2025年2-3月，机构发布<strong>8篇深度报告</strong></li>
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<li>• 关键词"混合键合"提及频次同比<strong>增长300%</strong></li>
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</ul>
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</div>
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<div class="bg-slate-800/50 rounded-lg p-4">
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<h4 class="text-white font-medium mb-2">预期差分析</h4>
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<ul class="text-gray-300 text-sm space-y-1">
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<li>• <strong>D2W技术</strong>进展超预期，研报普遍聚焦W2W</li>
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<li>• <strong>材料端机会</strong>被低估：临时键合胶、抛光液</li>
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</ul>
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</div>
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</div>
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</div>
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</div>
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</div>
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<!-- 关键催化剂与未来发展路径 -->
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<div class="tech-card rounded-xl p-6 mb-8">
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<div class="flex items-center mb-4">
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<i class="fas fa-fire text-orange-500 text-2xl mr-3"></i>
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<h2 class="text-2xl font-bold text-white">关键催化剂与未来发展路径</h2>
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</div>
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<div class="grid grid-cols-1 md:grid-cols-2 gap-6">
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<div>
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<h3 class="text-lg font-semibold text-orange-400 mb-3">近期催化剂（3-6个月）</h3>
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<div class="space-y-3">
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<div class="flex items-start">
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<div class="bg-orange-500 text-white rounded-full w-6 h-6 flex items-center justify-center text-xs font-bold mr-3 mt-0.5">1</div>
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<div>
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<p class="text-white font-medium">三星V10 NAND量产验证（2025年Q3）</p>
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<p class="text-gray-400 text-sm">若良率达标，将复制至海力士/美光，拉动W2W设备需求</p>
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</div>
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</div>
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<div class="flex items-start">
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<div class="bg-orange-500 text-white rounded-full w-6 h-6 flex items-center justify-center text-xs font-bold mr-3 mt-0.5">2</div>
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<div>
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<p class="text-white font-medium">HBM4标准确立（2025年Q2）</p>
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<p class="text-gray-400 text-sm">JEDEC明确混合键合为必选工艺，设备招标启动</p>
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</div>
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</div>
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<div class="flex items-start">
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<div class="bg-orange-500 text-white rounded-full w-6 h-6 flex items-center justify-center text-xs font-bold mr-3 mt-0.5">3</div>
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<div>
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<p class="text-white font-medium">国产设备验证节点（2025年Q4）</p>
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<p class="text-gray-400 text-sm">拓荆科技Dione 300在长江存储的16层堆叠HBM中试结果</p>
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</div>
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</div>
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</div>
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</div>
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<div>
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<h3 class="text-lg font-semibold text-orange-400 mb-3">长期发展路径</h3>
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<div class="bg-gradient-to-br from-slate-800 to-slate-900 rounded-lg p-5 h-full">
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<div class="flex items-center justify-between mb-4">
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<div class="text-center">
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<p class="text-gray-400 text-sm">2025-2026年</p>
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<p class="text-white font-bold text-lg">20亿→80亿元</p>
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<p class="text-gray-400 text-xs">HBM4/5、3D NAND规模化导入</p>
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</div>
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<i class="fas fa-arrow-right text-orange-500"></i>
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<div class="text-center">
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<p class="text-gray-400 text-sm">2027-2030年</p>
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<p class="text-white font-bold text-lg">200亿元</p>
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<p class="text-gray-400 text-xs">Chiplet、CPO技术渗透</p>
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</div>
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</div>
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<div class="w-full bg-gray-700 rounded-full h-2.5">
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<div class="bg-gradient-to-r from-orange-500 to-yellow-500 h-2.5 rounded-full" style="width: 35%"></div>
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</div>
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<p class="text-gray-400 text-xs mt-2 text-center">混合键合成为3D封装通用技术</p>
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</div>
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</div>
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</div>
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</div>
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<!-- 产业链与核心公司深度剖析 -->
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<div class="tech-card rounded-xl p-6 mb-8">
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<div class="flex items-center mb-4">
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<i class="fas fa-sitemap text-cyan-500 text-2xl mr-3"></i>
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<h2 class="text-2xl font-bold text-white">产业链与核心公司深度剖析</h2>
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</div>
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<div class="grid grid-cols-1 md:grid-cols-3 gap-6 mb-6">
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<div class="bg-gradient-to-br from-cyan-900/30 to-cyan-800/20 rounded-lg p-5 border border-cyan-700/30">
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<h3 class="text-lg font-semibold text-cyan-400 mb-3">上游</h3>
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<ul class="text-gray-300 text-sm space-y-1">
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<li>• 键合设备：EVG/SUSS/Besi/拓荆科技</li>
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<li>• 材料：临时键合胶（鼎龙股份）</li>
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<li>• 抛光液（安集科技）</li>
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</ul>
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</div>
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<div class="bg-gradient-to-br from-cyan-900/30 to-cyan-800/20 rounded-lg p-5 border border-cyan-700/30">
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<h3 class="text-lg font-semibold text-cyan-400 mb-3">中游</h3>
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<ul class="text-gray-300 text-sm space-y-1">
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<li>• 存储厂：三星/海力士/长江存储</li>
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<li>• 封测厂：台积电CoWoS、日月光</li>
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</ul>
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</div>
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<div class="bg-gradient-to-br from-cyan-900/30 to-cyan-800/20 rounded-lg p-5 border border-cyan-700/30">
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<h3 class="text-lg font-semibold text-cyan-400 mb-3">下游</h3>
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<ul class="text-gray-300 text-sm space-y-1">
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<li>• AI服务器：英伟达H200</li>
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<li>• 智能手机：苹果A18</li>
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</ul>
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</div>
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</div>
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<h3 class="text-lg font-semibold text-cyan-400 mb-3">核心玩家对比</h3>
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<div class="overflow-x-auto">
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<table class="w-full text-sm text-left text-gray-400">
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<thead class="text-xs text-gray-400 uppercase bg-slate-800/50">
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<tr>
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<th scope="col" class="px-4 py-3">公司</th>
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<th scope="col" class="px-4 py-3">角色</th>
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<th scope="col" class="px-4 py-3">进展</th>
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<th scope="col" class="px-4 py-3">风险</th>
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</tr>
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</thead>
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<tbody>
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<tr class="border-b border-slate-700/50 hover:bg-slate-800/30">
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<td class="px-4 py-3 font-medium text-white">拓荆科技</td>
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<td class="px-4 py-3">国产设备龙头</td>
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<td class="px-4 py-3">Dione 300获长江存储复购，W2W+D2W全覆盖</td>
|
||
<td class="px-4 py-3">验证周期长（12-18个月）</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-700/50 hover:bg-slate-800/30">
|
||
<td class="px-4 py-3 font-medium text-white">迈为股份</td>
|
||
<td class="px-4 py-3">追赶者</td>
|
||
<td class="px-4 py-3">精度<100nm设备发布，对标EVG</td>
|
||
<td class="px-4 py-3">尚未获头部客户订单</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-700/50 hover:bg-slate-800/30">
|
||
<td class="px-4 py-3 font-medium text-white">百傲化学</td>
|
||
<td class="px-4 py-3">参股设备商</td>
|
||
<td class="px-4 py-3">芯慧联D2W设备已出货国内头部存储厂</td>
|
||
<td class="px-4 py-3">持股比例低（10.48%），业绩弹性有限</td>
|
||
</tr>
|
||
<tr class="hover:bg-slate-800/30">
|
||
<td class="px-4 py-3 font-medium text-white">鼎龙股份</td>
|
||
<td class="px-4 py-3">材料供应商</td>
|
||
<td class="px-4 py-3">临时键合胶首获百万订单，国产替代0→1</td>
|
||
<td class="px-4 py-3">客户验证进度慢</td>
|
||
</tr>
|
||
</tbody>
|
||
</table>
|
||
</div>
|
||
</div>
|
||
|
||
<!-- 潜在风险与挑战 -->
|
||
<div class="tech-card rounded-xl p-6 mb-8">
|
||
<div class="flex items-center mb-4">
|
||
<i class="fas fa-exclamation-triangle text-red-500 text-2xl mr-3"></i>
|
||
<h2 class="text-2xl font-bold text-white">潜在风险与挑战</h2>
|
||
</div>
|
||
<div class="grid grid-cols-1 md:grid-cols-2 gap-6">
|
||
<div>
|
||
<h3 class="text-lg font-semibold text-red-400 mb-3">技术风险</h3>
|
||
<div class="bg-red-900/20 rounded-lg p-4 border border-red-800/30">
|
||
<p class="text-gray-300"><strong>良率瓶颈</strong>：混合键合需<strong>Ra<1nm表面粗糙度</strong>，当前国产CMP设备难以稳定达标</p>
|
||
</div>
|
||
</div>
|
||
<div>
|
||
<h3 class="text-lg font-semibold text-red-400 mb-3">商业化风险</h3>
|
||
<div class="bg-red-900/20 rounded-lg p-4 border border-red-800/30">
|
||
<p class="text-gray-300"><strong>成本敏感</strong>：单台设备<strong>200万欧元</strong>，HBM厂商可能延缓采购至2026年</p>
|
||
</div>
|
||
</div>
|
||
<div>
|
||
<h3 class="text-lg font-semibold text-red-400 mb-3">政策风险</h3>
|
||
<div class="bg-red-900/20 rounded-lg p-4 border border-red-800/30">
|
||
<p class="text-gray-300">美国若限制<strong>EVG/SUSS设备出口</strong>，国产替代进程或加速，但短期产能受限</p>
|
||
</div>
|
||
</div>
|
||
<div>
|
||
<h3 class="text-lg font-semibold text-red-400 mb-3">信息矛盾</h3>
|
||
<div class="bg-red-900/20 rounded-lg p-4 border border-red-800/30">
|
||
<p class="text-gray-300">新闻称"三星采用长江存储技术"，但路演指出<strong>Xtacking专利授权仅限NAND</strong>，HBM领域仍存壁垒</p>
|
||
</div>
|
||
</div>
|
||
</div>
|
||
</div>
|
||
|
||
<!-- 综合结论与投资启示 -->
|
||
<div class="tech-card rounded-xl p-6 mb-8">
|
||
<div class="flex items-center mb-4">
|
||
<i class="fas fa-trophy text-yellow-500 text-2xl mr-3"></i>
|
||
<h2 class="text-2xl font-bold text-white">综合结论与投资启示</h2>
|
||
</div>
|
||
<div class="grid grid-cols-1 md:grid-cols-2 gap-6">
|
||
<div>
|
||
<h3 class="text-lg font-semibold text-yellow-400 mb-3">阶段判断</h3>
|
||
<div class="bg-gradient-to-br from-yellow-900/30 to-yellow-800/20 rounded-lg p-5 border border-yellow-700/30">
|
||
<p class="text-gray-300">混合键合处于<strong>主题炒作向基本面过渡</strong>阶段，2025年HBM4量产是分水岭</p>
|
||
</div>
|
||
</div>
|
||
<div>
|
||
<h3 class="text-lg font-semibold text-yellow-400 mb-3">投资方向</h3>
|
||
<div class="bg-gradient-to-br from-yellow-900/30 to-yellow-800/20 rounded-lg p-5 border border-yellow-700/30">
|
||
<div class="space-y-3">
|
||
<div>
|
||
<p class="text-white font-medium">设备端</p>
|
||
<p class="text-gray-300 text-sm"><strong>拓荆科技</strong>（技术验证最快）> <strong>迈为股份</strong>（弹性大）</p>
|
||
</div>
|
||
<div>
|
||
<p class="text-white font-medium">材料端</p>
|
||
<p class="text-gray-300 text-sm"><strong>鼎龙股份</strong>（临时键合胶稀缺性）</p>
|
||
</div>
|
||
</div>
|
||
</div>
|
||
</div>
|
||
</div>
|
||
|
||
<h3 class="text-lg font-semibold text-yellow-400 mt-6 mb-3">跟踪指标</h3>
|
||
<div class="grid grid-cols-1 md:grid-cols-2 gap-4">
|
||
<div class="bg-slate-800/50 rounded-lg p-4 flex items-center">
|
||
<div class="bg-blue-500 rounded-full w-10 h-10 flex items-center justify-center mr-4">
|
||
<i class="fas fa-calendar-alt text-white"></i>
|
||
</div>
|
||
<div>
|
||
<p class="text-white font-medium">2025年Q3</p>
|
||
<p class="text-gray-400 text-sm">三星V10 NAND良率数据（验证技术成熟度）</p>
|
||
</div>
|
||
</div>
|
||
<div class="bg-slate-800/50 rounded-lg p-4 flex items-center">
|
||
<div class="bg-purple-500 rounded-full w-10 h-10 flex items-center justify-center mr-4">
|
||
<i class="fas fa-chart-pie text-white"></i>
|
||
</div>
|
||
<div>
|
||
<p class="text-white font-medium">2025年Q4</p>
|
||
<p class="text-gray-400 text-sm">长江存储HBM4设备招标份额（国产替代进度）</p>
|
||
</div>
|
||
</div>
|
||
</div>
|
||
|
||
<div class="mt-6 p-4 bg-red-900/20 rounded-lg border border-red-800/30">
|
||
<p class="text-red-400 font-medium flex items-center">
|
||
<i class="fas fa-exclamation-circle mr-2"></i>
|
||
风险提示
|
||
</p>
|
||
<p class="text-gray-300 text-sm mt-1">若HBM4量产延期或良率低于<strong>70%</strong>，设备需求可能下修50%</p>
|
||
</div>
|
||
</div>
|
||
|
||
<!-- 关联股票表格 -->
|
||
<div class="tech-card rounded-xl p-6">
|
||
<div class="flex items-center mb-4">
|
||
<i class="fas fa-chart-line text-green-500 text-2xl mr-3"></i>
|
||
<h2 class="text-2xl font-bold text-white">关联股票</h2>
|
||
</div>
|
||
<div class="table-container">
|
||
<table class="w-full text-sm text-left text-gray-400">
|
||
<thead class="text-xs text-gray-400 uppercase bg-slate-800/50">
|
||
<tr>
|
||
<th scope="col" class="px-4 py-3">股票名称</th>
|
||
<th scope="col" class="px-4 py-3">分类</th>
|
||
<th scope="col" class="px-4 py-3">业务相关</th>
|
||
<th scope="col" class="px-4 py-3">信源</th>
|
||
<th scope="col" class="px-4 py-3">行业</th>
|
||
</tr>
|
||
</thead>
|
||
<tbody>
|
||
<tr class="border-b border-slate-700/50 hover:bg-slate-800/30">
|
||
<td class="px-4 py-3 font-medium text-white">拓荆科技</td>
|
||
<td class="px-4 py-3"><span class="badge-tech badge-device">设备</span></td>
|
||
<td class="px-4 py-3">晶圆对晶圆混合键合设备、芯片对晶圆键合前表面预处理设备获得重复订单并扩大产业化应用，芯片对晶圆混合键合产品已获得客户订单并出货</td>
|
||
<td class="px-4 py-3">调研</td>
|
||
<td class="px-4 py-3">半导体设备</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-700/50 hover:bg-slate-800/30">
|
||
<td class="px-4 py-3 font-medium text-white">迈为股份</td>
|
||
<td class="px-4 py-3"><span class="badge-tech badge-device">设备</span></td>
|
||
<td class="px-4 py-3">自主研发的全自动晶圆级混合键合设备交付国内客户</td>
|
||
<td class="px-4 py-3">互动</td>
|
||
<td class="px-4 py-3">半导体设备</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-700/50 hover:bg-slate-800/30">
|
||
<td class="px-4 py-3 font-medium text-white">快克智能</td>
|
||
<td class="px-4 py-3"><span class="badge-tech badge-device">设备</span></td>
|
||
<td class="px-4 py-3">正进行先进封装键合设备的研发，预计2025年完成样机开发</td>
|
||
<td class="px-4 py-3">互动</td>
|
||
<td class="px-4 py-3">半导体设备</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-700/50 hover:bg-slate-800/30">
|
||
<td class="px-4 py-3 font-medium text-white">百傲化学</td>
|
||
<td class="px-4 py-3"><span class="badge-tech badge-device">设备</span></td>
|
||
<td class="px-4 py-3">参股公司芯慧联（持股10.48%）主营业务之一为混合键合设备</td>
|
||
<td class="px-4 py-3">公告</td>
|
||
<td class="px-4 py-3">半导体设备</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-700/50 hover:bg-slate-800/30">
|
||
<td class="px-4 py-3 font-medium text-white">北方华创</td>
|
||
<td class="px-4 py-3"><span class="badge-tech badge-device">设备</span></td>
|
||
<td class="px-4 py-3">参股北京烁合键维设备公司，对混合键合等前沿技术方向保持高度关注</td>
|
||
<td class="px-4 py-3">调研</td>
|
||
<td class="px-4 py-3">半导体设备</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-700/50 hover:bg-slate-800/30">
|
||
<td class="px-4 py-3 font-medium text-white">同兴达</td>
|
||
<td class="px-4 py-3"><span class="badge-tech badge-tech-patent">技术</span></td>
|
||
<td class="px-4 py-3">持续研发混合键合等关键技术</td>
|
||
<td class="px-4 py-3">调研</td>
|
||
<td class="px-4 py-3">半导体技术</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-700/50 hover:bg-slate-800/30">
|
||
<td class="px-4 py-3 font-medium text-white">苏州固锝</td>
|
||
<td class="px-4 py-3"><span class="badge-tech badge-tech-patent">技术</span></td>
|
||
<td class="px-4 py-3">拥有完整的半导体封装测试技术，掌握了混合键合技术</td>
|
||
<td class="px-4 py-3">年报</td>
|
||
<td class="px-4 py-3">半导体技术</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-700/50 hover:bg-slate-800/30">
|
||
<td class="px-4 py-3 font-medium text-white">华润微</td>
|
||
<td class="px-4 py-3"><span class="badge-tech badge-tech-patent">技术专利</span></td>
|
||
<td class="px-4 py-3">异构集成方式制造MEMS产品及其技术研发涉及混合键合技术</td>
|
||
<td class="px-4 py-3">年报</td>
|
||
<td class="px-4 py-3">半导体技术</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-700/50 hover:bg-slate-800/30">
|
||
<td class="px-4 py-3 font-medium text-white">赛微电子</td>
|
||
<td class="px-4 py-3"><span class="badge-tech badge-tech-patent">技术专利</span></td>
|
||
<td class="px-4 py-3">热压和共晶混合键合（发明专利）</td>
|
||
<td class="px-4 py-3">年报</td>
|
||
<td class="px-4 py-3">半导体技术</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-700/50 hover:bg-slate-800/30">
|
||
<td class="px-4 py-3 font-medium text-white">华天科技</td>
|
||
<td class="px-4 py-3"><span class="badge-tech badge-tech-patent">技术专利</span></td>
|
||
<td class="px-4 py-3">基于混合键合的晶圆级CMOS图像传感器三维集成技术研究</td>
|
||
<td class="px-4 py-3">公告</td>
|
||
<td class="px-4 py-3">半导体技术</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-700/50 hover:bg-slate-800/30">
|
||
<td class="px-4 py-3 font-medium text-white">江波龙</td>
|
||
<td class="px-4 py-3"><span class="badge-tech badge-material">耗材</span></td>
|
||
<td class="px-4 py-3">子公司元成苏州具备多层封装、混合键合封装技术的量产能力</td>
|
||
<td class="px-4 py-3">互动</td>
|
||
<td class="px-4 py-3">半导体耗材</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-700/50 hover:bg-slate-800/30">
|
||
<td class="px-4 py-3 font-medium text-white">安集科技</td>
|
||
<td class="px-4 py-3"><span class="badge-tech badge-material">耗材</span></td>
|
||
<td class="px-4 py-3">混合键合抛光液</td>
|
||
<td class="px-4 py-3">年报</td>
|
||
<td class="px-4 py-3">半导体耗材</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-700/50 hover:bg-slate-800/30">
|
||
<td class="px-4 py-3 font-medium text-white">天承科技</td>
|
||
<td class="px-4 py-3"><span class="badge-tech badge-material">耗材</span></td>
|
||
<td class="px-4 py-3">公司研发混合键合工艺等相关添加剂产品和应用技术，目前正努力推广中</td>
|
||
<td class="px-4 py-3">年报</td>
|
||
<td class="px-4 py-3">半导体耗材</td>
|
||
</tr>
|
||
<tr class="hover:bg-slate-800/30">
|
||
<td class="px-4 py-3 font-medium text-white">微导纳米</td>
|
||
<td class="px-4 py-3"><span class="badge-tech badge-other">其他</span></td>
|
||
<td class="px-4 py-3">公司iTronixLTP系列低温等离子体化学气相沉积系统，适用于混合键合的介电层</td>
|
||
<td class="px-4 py-3">公告</td>
|
||
<td class="px-4 py-3">半导体设备</td>
|
||
</tr>
|
||
</tbody>
|
||
</table>
|
||
</div>
|
||
</div>
|
||
</div>
|
||
|
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<script src="https://cdn.jsdelivr.net/npm/tsparticles@3/tsparticles.bundle.min.js"></script>
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<script>
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tsParticles.load("particles-js", {
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|
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|
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|
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|
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|
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|
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|
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``` |