689 lines
32 KiB
HTML
689 lines
32 KiB
HTML
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<div id="particles-js" class="tech-bg"></div>
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<div class="container mx-auto px-4 py-8 max-w-6xl">
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<!-- 标题部分 -->
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<div class="text-center mb-12">
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<h1 class="text-4xl md:text-5xl font-bold mb-4">
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<span class="highlight">盛合晶微概念股</span>分析报告
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</h1>
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<p class="text-lg text-slate-300 max-w-3xl mx-auto">
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深度解析大陆先进封装龙头盛合晶微的产业链布局、技术突破及投资机会
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</p>
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</div>
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<!-- 概念事件部分 -->
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<div class="section-card p-6 mb-8">
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<h2 class="text-2xl font-bold mb-4 flex items-center">
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<i class="fas fa-history mr-3 text-blue-400"></i>
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概念事件
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</h2>
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<div class="mb-6">
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<h3 class="text-xl font-semibold mb-3 text-blue-300">背景与催化事件</h3>
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<p class="mb-4">
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盛合晶微（SJ Semiconductor）前身为"中芯长电"，由中芯国际与长电科技于2014年联合孵化，专注<span class="chip chip-blue">12英寸先进封装</span>（Bumping、WLCSP、TSV等）。2023-2024年，公司因<span class="chip chip-purple">IPO进程加速</span>和<span class="chip chip-green">技术突破</span>成为市场焦点：
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</p>
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<ul class="list-disc pl-6 space-y-2">
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<li><span class="font-semibold">2023年6月</span>：启动IPO辅导（中金证券）。</li>
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<li><span class="font-semibold">2024年2月</span>：增加中信证券为联合保荐，后因合规问题调整为中金独家保荐，<span class="highlight">上市进程实质性推进</span>。</li>
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<li><span class="font-semibold">2024年5月</span>：推出<span class="chip chip-yellow">3倍光罩尺寸TSV硅通孔载板技术</span>，填补大陆2.5D芯粒封装空白。</li>
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<li><span class="font-semibold">2024年12月</span>：完成<span class="chip chip-red">7亿美元（超50亿人民币）定向融资</span>，引入无锡/上海国资，用于84亿元三维多芯片集成项目（bumping 8万片/月、3D封装1.6万片/月）。</li>
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<li><span class="font-semibold">2025年6月18日</span>：IPO辅导状态变更为<span class="highlight">"辅导验收"</span>，科创板上市临门一脚。</li>
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</ul>
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</div>
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<div>
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<h3 class="text-xl font-semibold mb-3 text-blue-300">时间轴</h3>
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<div class="overflow-x-auto">
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<table class="w-full">
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<thead>
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<tr class="border-b border-slate-700">
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<th class="text-left py-2 px-4">时间</th>
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<th class="text-left py-2 px-4">事件</th>
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<th class="text-left py-2 px-4">影响</th>
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</tr>
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</thead>
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<tbody>
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<tr class="border-b border-slate-800">
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<td class="py-3 px-4">2023年6月</td>
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<td class="py-3 px-4">启动IPO辅导</td>
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<td class="py-3 px-4">市场预期升温</td>
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</tr>
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<tr class="border-b border-slate-800">
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<td class="py-3 px-4">2024年5月</td>
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<td class="py-3 px-4">TSV技术突破</td>
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<td class="py-3 px-4">技术龙头地位确立</td>
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</tr>
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<tr class="border-b border-slate-800">
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<td class="py-3 px-4">2024年12月</td>
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<td class="py-3 px-4">50亿融资落地</td>
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<td class="py-3 px-4">产能扩张加速</td>
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</tr>
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<tr>
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<td class="py-3 px-4">2025年6月</td>
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<td class="py-3 px-4">辅导验收</td>
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<td class="py-3 px-4">上市催化临近</td>
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</tr>
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</tbody>
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</table>
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</div>
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</div>
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</div>
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<!-- 核心观点摘要 -->
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<div class="section-card p-6 mb-8">
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<h2 class="text-2xl font-bold mb-4 flex items-center">
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<i class="fas fa-lightbulb mr-3 text-yellow-400"></i>
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核心观点摘要
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</h2>
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<div class="bg-gradient-to-r from-blue-900/30 to-purple-900/30 p-5 rounded-lg border border-blue-500/20">
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<p class="text-lg leading-relaxed">
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盛合晶微是<span class="highlight">大陆先进封装绝对龙头</span>，技术（TSV/2.5D）和产能（12英寸Bumping市占率第一）双重壁垒显著。当前处于<span class="chip chip-purple">IPO落地前夜</span>，短期受上市催化，长期受益于<span class="chip chip-green">AI算力芯片国产化</span>和<span class="chip chip-blue">Chiplet技术渗透</span>。但需警惕<span class="chip chip-red">客户集中度（华为系）</span>和<span class="chip chip-yellow">海外材料依赖</span>风险。
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</p>
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</div>
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</div>
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<!-- 概念的核心逻辑与市场认知分析 -->
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<div class="section-card p-6 mb-8">
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<h2 class="text-2xl font-bold mb-4 flex items-center">
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<i class="fas fa-brain mr-3 text-purple-400"></i>
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概念的核心逻辑与市场认知分析
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</h2>
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<div class="mb-6">
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<h3 class="text-xl font-semibold mb-3 text-purple-300">核心驱动力</h3>
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<ul class="space-y-3">
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<li class="flex items-start">
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<i class="fas fa-microchip text-blue-400 mt-1 mr-3"></i>
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<div>
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<span class="font-semibold">技术卡位</span>：大陆唯一规模量产<span class="chip chip-blue">硅基2.5D封装</span>（TSV深孔制造），直接服务<span class="chip chip-green">昇腾、麒麟</span>等高端芯片。
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</div>
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</li>
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<li class="flex items-start">
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<i class="fas fa-chart-line text-green-400 mt-1 mr-3"></i>
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<div>
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<span class="font-semibold">需求爆发</span>：AI算力芯片（如寒武纪、海光）需Chiplet方案突破制程限制，<span class="highlight">2025年全球先进封装市场569亿美元</span>（Yole数据）。
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</div>
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</li>
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<li class="flex items-start">
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<i class="fas fa-flag text-red-400 mt-1 mr-3"></i>
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<div>
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<span class="font-semibold">国产替代</span>：美国限制台积电对华代工，<span class="chip chip-yellow">中芯国际+盛合晶微</span>成为国产AI芯片封装唯一选择。
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</div>
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</li>
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</ul>
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</div>
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<div class="mb-6">
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<h3 class="text-xl font-semibold mb-3 text-purple-300">市场热度与情绪</h3>
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<div class="grid grid-cols-1 md:grid-cols-2 gap-4">
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<div class="bg-blue-900/20 p-4 rounded-lg border border-blue-500/30">
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<h4 class="font-semibold mb-2 text-blue-300">新闻热度</h4>
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<p>6月18日辅导验收后，<span class="highlight">民生电子、华西机械、浙商电子</span>连发3篇研报，关键词"先进封装龙头""AI算力催化"。</p>
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</div>
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<div class="bg-purple-900/20 p-4 rounded-lg border border-purple-500/30">
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<h4 class="font-semibold mb-2 text-purple-300">情绪分歧</h4>
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<p>乐观方（浙商电子）认为"上市将吸引资本涌入"，谨慎方（路演纪要）提示<span class="chip chip-red">"28nm以下技术验证滞后"</span>。</p>
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</div>
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</div>
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</div>
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<div>
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<h3 class="text-xl font-semibold mb-3 text-purple-300">预期差</h3>
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<ul class="space-y-3">
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<li class="flex items-start">
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<i class="fas fa-exclamation-triangle text-yellow-400 mt-1 mr-3"></i>
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<div>
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<span class="font-semibold">材料国产化率不足</span>：PSPI、EMC等关键材料<span class="chip chip-red">90%依赖进口</span>（强力新材、华海诚科仍在认证）。
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</div>
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</li>
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<li class="flex items-start">
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<i class="fas fa-exclamation-triangle text-yellow-400 mt-1 mr-3"></i>
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<div>
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<span class="font-semibold">客户结构单一</span>：<span class="chip chip-yellow">华为系订单占比超60%</span>（路演纪要），若地缘政治恶化可能砍单。
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</div>
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</li>
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</ul>
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</div>
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</div>
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<!-- 关键催化剂与未来发展路径 -->
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<div class="section-card p-6 mb-8">
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<h2 class="text-2xl font-bold mb-4 flex items-center">
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<i class="fas fa-rocket mr-3 text-green-400"></i>
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关键催化剂与未来发展路径
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</h2>
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<div class="mb-6">
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<h3 class="text-xl font-semibold mb-3 text-green-300">近期催化剂（3-6个月）</h3>
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<div class="grid grid-cols-1 md:grid-cols-2 gap-4">
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<div class="bg-gradient-to-br from-green-900/30 to-teal-900/30 p-4 rounded-lg border border-green-500/30">
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<h4 class="font-semibold mb-2 text-green-300">IPO过会</h4>
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<p>预计2025年Q3科创板上市，参考<span class="chip chip-blue">中芯国际</span>上市时板块涨幅（+30%）。</p>
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</div>
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<div class="bg-gradient-to-br from-blue-900/30 to-indigo-900/30 p-4 rounded-lg border border-blue-500/30">
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<h4 class="font-semibold mb-2 text-blue-300">华为910C量产</h4>
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<p>昇腾芯片采用盛合晶微2.5D封装，<span class="chip chip-purple">Q4订单或超预期</span>（路演纪要）。</p>
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</div>
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</div>
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</div>
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<div>
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<h3 class="text-xl font-semibold mb-3 text-green-300">长期路径</h3>
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<div class="space-y-4">
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<div class="timeline-item pb-4">
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<h4 class="font-semibold mb-1">2025-2026年</h4>
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<p>IPO募资扩产，<span class="chip chip-blue">28nm以下TSV技术</span>量产，切入<span class="chip chip-purple">HBM封装</span>（需验证EMC材料）。</p>
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</div>
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<div class="timeline-item">
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<h4 class="font-semibold mb-1">2027年后</h4>
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<p>成为全球第三大2.5D封装厂（仅次于台积电、三星），<span class="highlight">市占率15%</span>（浙商电子预测）。</p>
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</div>
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</div>
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</div>
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</div>
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<!-- 产业链与核心公司深度剖析 -->
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<div class="section-card p-6 mb-8">
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<h2 class="text-2xl font-bold mb-4 flex items-center">
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<i class="fas fa-sitemap mr-3 text-indigo-400"></i>
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产业链与核心公司深度剖析
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</h2>
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<div class="mb-6">
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<h3 class="text-xl font-semibold mb-3 text-indigo-300">产业链图谱</h3>
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<div class="grid grid-cols-1 md:grid-cols-3 gap-4">
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<div class="bg-slate-800/50 p-4 rounded-lg text-center">
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<h4 class="font-semibold mb-2 text-blue-300">上游</h4>
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<p>设备（芯源微、拓荆）、材料（强力新材、华海诚科）</p>
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</div>
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<div class="bg-slate-800/50 p-4 rounded-lg text-center">
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<h4 class="font-semibold mb-2 text-purple-300">中游</h4>
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<p>盛合晶微（封装代工）、长电/通富（传统封测）</p>
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</div>
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<div class="bg-slate-800/50 p-4 rounded-lg text-center">
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<h4 class="font-semibold mb-2 text-green-300">下游</h4>
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<p>华为（昇腾）、寒武纪（MLU）、比特大陆（矿机芯片）</p>
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</div>
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</div>
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</div>
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<div>
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<h3 class="text-xl font-semibold mb-3 text-indigo-300">核心玩家对比</h3>
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<div class="overflow-x-auto">
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<table class="w-full">
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<thead>
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<tr class="border-b border-slate-700">
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<th class="text-left py-2 px-4">公司</th>
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<th class="text-left py-2 px-4">关联逻辑</th>
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<th class="text-left py-2 px-4">竞争优势</th>
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<th class="text-left py-2 px-4">风险点</th>
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</tr>
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</thead>
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<tbody>
|
||
<tr class="border-b border-slate-800">
|
||
<td class="py-3 px-4 font-semibold">盛合晶微</td>
|
||
<td class="py-3 px-4">2.5D封装龙头，华为核心供应商</td>
|
||
<td class="py-3 px-4">技术唯一性+产能第一</td>
|
||
<td class="py-3 px-4">客户集中度高</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800">
|
||
<td class="py-3 px-4 font-semibold">长电科技</td>
|
||
<td class="py-3 px-4">XDFOI® Chiplet量产</td>
|
||
<td class="py-3 px-4">传统封测规模优势</td>
|
||
<td class="py-3 px-4">先进封装技术落后盛合</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800">
|
||
<td class="py-3 px-4 font-semibold">芯源微</td>
|
||
<td class="py-3 px-4">涂胶显影设备主供盛合晶微</td>
|
||
<td class="py-3 px-4">国产替代+订单饱满</td>
|
||
<td class="py-3 px-4">设备验证周期长</td>
|
||
</tr>
|
||
<tr>
|
||
<td class="py-3 px-4 font-semibold">强力新材</td>
|
||
<td class="py-3 px-4">PSPI材料认证中</td>
|
||
<td class="py-3 px-4">国产替代空间大</td>
|
||
<td class="py-3 px-4"><span class="chip chip-red">尚未通过客户认证</span></td>
|
||
</tr>
|
||
</tbody>
|
||
</table>
|
||
</div>
|
||
</div>
|
||
</div>
|
||
|
||
<!-- 潜在风险与挑战 -->
|
||
<div class="section-card p-6 mb-8">
|
||
<h2 class="text-2xl font-bold mb-4 flex items-center">
|
||
<i class="fas fa-shield-alt mr-3 text-red-400"></i>
|
||
潜在风险与挑战
|
||
</h2>
|
||
<div class="grid grid-cols-1 md:grid-cols-2 gap-4">
|
||
<div class="bg-red-900/20 p-4 rounded-lg border border-red-500/30">
|
||
<h3 class="font-semibold mb-2 text-red-300">技术风险</h3>
|
||
<p><span class="chip chip-yellow">28nm以下TSV良率</span>未经验证（路演纪要）。</p>
|
||
</div>
|
||
<div class="bg-red-900/20 p-4 rounded-lg border border-red-500/30">
|
||
<h3 class="font-semibold mb-2 text-red-300">商业化风险</h3>
|
||
<p><span class="chip chip-purple">HBM封装成本</span>为传统方案3倍，下游接受度待观察。</p>
|
||
</div>
|
||
<div class="bg-red-900/20 p-4 rounded-lg border border-red-500/30">
|
||
<h3 class="font-semibold mb-2 text-red-300">政策风险</h3>
|
||
<p>美国若限制<span class="chip chip-blue">EDA工具</span>对华出口，影响芯片设计-封装协同。</p>
|
||
</div>
|
||
<div class="bg-red-900/20 p-4 rounded-lg border border-red-500/30">
|
||
<h3 class="font-semibold mb-2 text-red-300">信息矛盾</h3>
|
||
<p>新闻称"盛合晶微材料国产化空间大"，但<span class="chip chip-green">安集科技</span>路演显示"CMP材料已批量供货"，需核实具体品类。</p>
|
||
</div>
|
||
</div>
|
||
</div>
|
||
|
||
<!-- 综合结论与投资启示 -->
|
||
<div class="section-card p-6 mb-8">
|
||
<h2 class="text-2xl font-bold mb-4 flex items-center">
|
||
<i class="fas fa-chart-pie mr-3 text-teal-400"></i>
|
||
综合结论与投资启示
|
||
</h2>
|
||
|
||
<div class="mb-6">
|
||
<h3 class="text-xl font-semibold mb-3 text-teal-300">阶段判断</h3>
|
||
<div class="bg-gradient-to-r from-teal-900/30 to-cyan-900/30 p-5 rounded-lg border border-teal-500/20">
|
||
<p class="text-lg">
|
||
处于<span class="highlight">主题炒作向基本面过渡</span>阶段，IPO催化+华为订单为短期核心。
|
||
</p>
|
||
</div>
|
||
</div>
|
||
|
||
<div class="mb-6">
|
||
<h3 class="text-xl font-semibold mb-3 text-teal-300">投资方向</h3>
|
||
<ul class="space-y-3">
|
||
<li class="flex items-start">
|
||
<i class="fas fa-microchip text-blue-400 mt-1 mr-3"></i>
|
||
<div>
|
||
<span class="font-semibold">设备环节</span>：<span class="chip chip-blue">芯源微</span>（涂胶显影机）、<span class="chip chip-blue">拓荆科技</span>（混合键合设备）。
|
||
</div>
|
||
</li>
|
||
<li class="flex items-start">
|
||
<i class="fas fa-flask text-purple-400 mt-1 mr-3"></i>
|
||
<div>
|
||
<span class="font-semibold">材料替代</span>：<span class="chip chip-purple">华海诚科</span>（EMC）、<span class="chip chip-purple">飞凯材料</span>（临时键合胶）。
|
||
</div>
|
||
</li>
|
||
</ul>
|
||
</div>
|
||
|
||
<div>
|
||
<h3 class="text-xl font-semibold mb-3 text-teal-300">跟踪指标</h3>
|
||
<ul class="space-y-2">
|
||
<li class="flex items-start">
|
||
<i class="fas fa-check-circle text-green-400 mt-1 mr-3"></i>
|
||
<div><span class="chip chip-green">盛合晶微IPO过会时间</span>（证监会官网）。</div>
|
||
</li>
|
||
<li class="flex items-start">
|
||
<i class="fas fa-check-circle text-green-400 mt-1 mr-3"></i>
|
||
<div><span class="chip chip-green">华为昇腾910C出货量</span>（供应链调研）。</div>
|
||
</li>
|
||
<li class="flex items-start">
|
||
<i class="fas fa-check-circle text-green-400 mt-1 mr-3"></i>
|
||
<div><span class="chip chip-green">PSPI/EMC材料认证进度</span>（强力新材、华海诚科公告）。</div>
|
||
</li>
|
||
</ul>
|
||
</div>
|
||
</div>
|
||
|
||
<!-- 关联股票数据表格 -->
|
||
<div class="section-card p-6 mb-8">
|
||
<h2 class="text-2xl font-bold mb-4 flex items-center">
|
||
<i class="fas fa-table mr-3 text-cyan-400"></i>
|
||
盛合晶微概念股关联股票
|
||
</h2>
|
||
<div class="table-container">
|
||
<table class="w-full">
|
||
<thead>
|
||
<tr class="border-b border-slate-700">
|
||
<th class="text-left py-3 px-4">股票名称</th>
|
||
<th class="text-left py-3 px-4">分类</th>
|
||
<th class="text-left py-3 px-4">项目</th>
|
||
<th class="text-left py-3 px-4">产业链</th>
|
||
<th class="text-left py-3 px-4">消息来源</th>
|
||
<th class="text-left py-3 px-4">关联原因</th>
|
||
</tr>
|
||
</thead>
|
||
<tbody>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/30">
|
||
<td class="py-3 px-4 font-semibold">亿道信息</td>
|
||
<td class="py-3 px-4"><span class="chip chip-blue">股权相关</span></td>
|
||
<td class="py-3 px-4">参与盛合晶微股权投资</td>
|
||
<td class="py-3 px-4">半导体行业</td>
|
||
<td class="py-3 px-4">公开资料</td>
|
||
<td class="py-3 px-4">2023年1月1000万元参股盛合晶微，通过认缴1050万元参与设立私募基金投资盛合晶微股权</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/30">
|
||
<td class="py-3 px-4 font-semibold">上峰水泥</td>
|
||
<td class="py-3 px-4"><span class="chip chip-blue">股权相关</span></td>
|
||
<td class="py-3 px-4">投资半导体行业及新材料领域</td>
|
||
<td class="py-3 px-4">半导体行业</td>
|
||
<td class="py-3 px-4">公司互动</td>
|
||
<td class="py-3 px-4">投资了系列半导体行业及新材料等领域企业股权，包括参股盛合晶微0.9932%股份</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/30">
|
||
<td class="py-3 px-4 font-semibold">景兴纸业</td>
|
||
<td class="py-3 px-4"><span class="chip chip-blue">股权相关</span></td>
|
||
<td class="py-3 px-4">景兴实业投资金浦国调并购基金</td>
|
||
<td class="py-3 px-4">半导体行业</td>
|
||
<td class="py-3 px-4">公司互动</td>
|
||
<td class="py-3 px-4">全资子公司景兴实业投资8500万元金浦国调并购基金，该基金持有盛合晶微1.0038%股权（截至2023年12月31日）</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/30">
|
||
<td class="py-3 px-4 font-semibold">赛伍技术</td>
|
||
<td class="py-3 px-4"><span class="chip chip-purple">业务往来</span></td>
|
||
<td class="py-3 px-4">先进封装领域合作</td>
|
||
<td class="py-3 px-4">半导体材料</td>
|
||
<td class="py-3 px-4">公司公告</td>
|
||
<td class="py-3 px-4">积极推进盛合晶微半导体、台湾矽品、台湾日月光的导入测试</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/30">
|
||
<td class="py-3 px-4 font-semibold">强力新材</td>
|
||
<td class="py-3 px-4"><span class="chip chip-purple">业务往来</span></td>
|
||
<td class="py-3 px-4">光敏性聚酰亚胺(PSPI)认证</td>
|
||
<td class="py-3 px-4">半导体材料</td>
|
||
<td class="py-3 px-4">公司互动</td>
|
||
<td class="py-3 px-4">公司回复称PSPI仍处于客户认证阶段，尚未通过客户认证</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/30">
|
||
<td class="py-3 px-4 font-semibold">芯源微</td>
|
||
<td class="py-3 px-4"><span class="chip chip-purple">业务往来</span></td>
|
||
<td class="py-3 px-4">涂胶显影设备及单片式湿法设备供应</td>
|
||
<td class="py-3 px-4">半导体设备</td>
|
||
<td class="py-3 px-4">公司公告</td>
|
||
<td class="py-3 px-4">生产的涂胶显影设备、单片式湿法设备连续多年作为主力量产机台批量应用于台积电、盛合晶微等</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/30">
|
||
<td class="py-3 px-4 font-semibold">安集科技</td>
|
||
<td class="py-3 px-4"><span class="chip chip-purple">业务往来</span></td>
|
||
<td class="py-3 px-4">CMP研磨液供应</td>
|
||
<td class="py-3 px-4">半导体材料</td>
|
||
<td class="py-3 px-4">网传纪要/公司公告</td>
|
||
<td class="py-3 px-4">已进入盛合晶微产业链，向其等先进封装领域客户实现销售收入</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/30">
|
||
<td class="py-3 px-4 font-semibold">东芯股份</td>
|
||
<td class="py-3 px-4"><span class="chip chip-purple">业务往来</span></td>
|
||
<td class="py-3 px-4">封测厂合作</td>
|
||
<td class="py-3 px-4">半导体封测</td>
|
||
<td class="py-3 px-4">公司公告</td>
|
||
<td class="py-3 px-4">与宏茂微、盛合晶微、南茂科技等国内外知名封测厂建立稳定合作关系</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/30">
|
||
<td class="py-3 px-4 font-semibold">艾森股份</td>
|
||
<td class="py-3 px-4"><span class="chip chip-purple">业务往来</span></td>
|
||
<td class="py-3 px-4">先进封装负性光刻胶认证</td>
|
||
<td class="py-3 px-4">半导体材料</td>
|
||
<td class="py-3 px-4">公司互动</td>
|
||
<td class="py-3 px-4">公司先进封装负性光刻胶在盛合晶微测试认证中</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/30">
|
||
<td class="py-3 px-4 font-semibold">恒烁股份</td>
|
||
<td class="py-3 px-4"><span class="chip chip-purple">业务往来</span></td>
|
||
<td class="py-3 px-4">晶圆测试及芯片封测供应</td>
|
||
<td class="py-3 px-4">半导体封测</td>
|
||
<td class="py-3 px-4">公司公告</td>
|
||
<td class="py-3 px-4">与江阴盛合晶微建立持续稳定合作关系，产能供应充足</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/30">
|
||
<td class="py-3 px-4 font-semibold">飞凯材料</td>
|
||
<td class="py-3 px-4"><span class="chip chip-purple">业务往来</span></td>
|
||
<td class="py-3 px-4">半导体材料合作</td>
|
||
<td class="py-3 px-4">半导体材料</td>
|
||
<td class="py-3 px-4">公司互动</td>
|
||
<td class="py-3 px-4">半导体材料领域客户主要为大型封装测试厂商，基于商业保密原则不便披露具体客户信息</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/30">
|
||
<td class="py-3 px-4 font-semibold">光力科技</td>
|
||
<td class="py-3 px-4"><span class="chip chip-purple">业务往来</span></td>
|
||
<td class="py-3 px-4">12英寸晶圆切割设备验证</td>
|
||
<td class="py-3 px-4">半导体设备</td>
|
||
<td class="py-3 px-4">网络传闻</td>
|
||
<td class="py-3 px-4">国内唯一可实现12英寸晶圆切割设备量产上市公司，划片机处于盛合晶微验证流程中</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/30">
|
||
<td class="py-3 px-4 font-semibold">亚翔集成</td>
|
||
<td class="py-3 px-4"><span class="chip chip-purple">业务往来</span></td>
|
||
<td class="py-3 px-4">洁净工程服务</td>
|
||
<td class="py-3 px-4">半导体工程服务</td>
|
||
<td class="py-3 px-4">公司互动</td>
|
||
<td class="py-3 px-4">承接江阴盛合晶微（原江阴长电）等封装与测试公司的洁净工程服务，目前在建项目主要是盛合晶微</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/30">
|
||
<td class="py-3 px-4 font-semibold">康强电子</td>
|
||
<td class="py-3 px-4"><span class="chip chip-green">封装材料</span></td>
|
||
<td class="py-3 px-4">引线框架和键合丝供应</td>
|
||
<td class="py-3 px-4">半导体封装材料</td>
|
||
<td class="py-3 px-4">公开资料</td>
|
||
<td class="py-3 px-4">引线框架和键合丝国内第一，国内市场占有率达20%左右</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/30">
|
||
<td class="py-3 px-4 font-semibold">德邦科技</td>
|
||
<td class="py-3 px-4"><span class="chip chip-green">封装材料</span></td>
|
||
<td class="py-3 px-4">晶圆UV膜供应</td>
|
||
<td class="py-3 px-4">半导体封装材料</td>
|
||
<td class="py-3 px-4">网传纪要</td>
|
||
<td class="py-3 px-4">晶圆UV膜市占率第一</td>
|
||
</tr>
|
||
<tr class="border-b border-slate-800 hover:bg-slate-800/30">
|
||
<td class="py-3 px-4 font-semibold">华海诚科</td>
|
||
<td class="py-3 px-4"><span class="chip chip-green">封装材料</span></td>
|
||
<td class="py-3 px-4">环氧塑封料供应</td>
|
||
<td class="py-3 px-4">半导体封装材料</td>
|
||
<td class="py-3 px-4">机构研报</td>
|
||
<td class="py-3 px-4">上市公司环氧塑封料唯一标的</td>
|
||
</tr>
|
||
<tr class="hover:bg-slate-800/30">
|
||
<td class="py-3 px-4 font-semibold">华正新材</td>
|
||
<td class="py-3 px-4"><span class="chip chip-green">封装材料</span></td>
|
||
<td class="py-3 px-4">ABF载板上游树脂材料供应</td>
|
||
<td class="py-3 px-4">半导体封装材料</td>
|
||
<td class="py-3 px-4">网传纪要</td>
|
||
<td class="py-3 px-4">ABF载板上游核心树脂材料供应商，有望率先打破日本厂商垄断</td>
|
||
</tr>
|
||
</tbody>
|
||
</table>
|
||
</div>
|
||
</div>
|
||
</div>
|
||
|
||
<!-- JavaScript -->
|
||
<script src="https://cdn.jsdelivr.net/npm/tsparticles@3/tsparticles.bundle.min.js"></script>
|
||
<script>
|
||
// 初始化粒子背景
|
||
tsParticles.load("particles-js", {
|
||
particles: {
|
||
number: {
|
||
value: 80,
|
||
density: {
|
||
enable: true,
|
||
value_area: 800
|
||
}
|
||
},
|
||
color: {
|
||
value: "#3b82f6"
|
||
},
|
||
shape: {
|
||
type: "circle"
|
||
},
|
||
opacity: {
|
||
value: 0.5,
|
||
random: false
|
||
},
|
||
size: {
|
||
value: 3,
|
||
random: true
|
||
},
|
||
line_linked: {
|
||
enable: true,
|
||
distance: 150,
|
||
color: "#3b82f6",
|
||
opacity: 0.4,
|
||
width: 1
|
||
},
|
||
move: {
|
||
enable: true,
|
||
speed: 2,
|
||
direction: "none",
|
||
random: false,
|
||
straight: false,
|
||
out_mode: "out",
|
||
bounce: false
|
||
}
|
||
},
|
||
interactivity: {
|
||
detect_on: "canvas",
|
||
events: {
|
||
onhover: {
|
||
enable: true,
|
||
mode: "grab"
|
||
},
|
||
onclick: {
|
||
enable: true,
|
||
mode: "push"
|
||
},
|
||
resize: true
|
||
},
|
||
modes: {
|
||
grab: {
|
||
distance: 140,
|
||
line_linked: {
|
||
opacity: 1
|
||
}
|
||
},
|
||
push: {
|
||
particles_nb: 4
|
||
}
|
||
}
|
||
},
|
||
retina_detect: true
|
||
});
|
||
</script>
|
||
</body>
|
||
</html>
|
||
``` |