551 lines
38 KiB
HTML
551 lines
38 KiB
HTML
<!DOCTYPE html>
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<html lang="zh-CN" data-theme="night">
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<meta charset="UTF-8">
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<meta name="viewport" content="width=device-width, initial-scale=1.0">
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<title>半导体材料 - 深度投研报告</title>
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background-color: #000212;
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background-image:
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radial-gradient(ellipse 50% 80% at 50% -20%, rgba(60, 48, 128, 0.4), transparent),
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-webkit-backdrop-filter: blur(20px);
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border: 1px solid rgba(255, 255, 255, 0.1);
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border-radius: 1.5rem; /* 24px */
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box-shadow: 0 8px 32px 0 rgba(0, 0, 0, 0.37);
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box-shadow: 0 0 15px #4f46e5;
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</head>
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<body class="text-gray-300">
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<div class="container mx-auto p-4 md:p-8">
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<!-- Header -->
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<header class="text-center py-12">
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<h1 class="text-4xl md:text-6xl font-bold text-transparent bg-clip-text bg-gradient-to-r from-purple-400 via-pink-500 to-red-500 animate-pulse">
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半导体材料
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</h1>
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<h2 class="text-2xl md:text-3xl font-light text-gray-200 mt-4">深度投研报告</h2>
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<p class="mt-6 text-sm text-gray-500 max-w-2xl mx-auto">
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北京价值前沿科技有限公司 AI投研agent：“价小前投研” 进行投研呈现。
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<br>本报告基于新闻、路演、研报、insight及股票数据由AI合成，不构成投资建议，投资需谨慎。
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</p>
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</header>
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<!-- Main Content -->
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<main class="space-y-12">
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<!-- Section 0: 概念事件 -->
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<section>
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<h3 class="text-2xl font-bold mb-6 text-white tracking-wider">概念事件驱动</h3>
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<div class="grid grid-cols-1 lg:grid-cols-3 gap-6">
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<div class="glass-card p-6">
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<h4 class="font-bold text-lg text-purple-400 mb-3">长期驱动 (2022至今)</h4>
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<p class="text-sm">以美国《芯片与科学法案》为代表的地缘政治博弈升级，迫使国内晶圆厂将供应链安全置于战略高度，启动全面深刻的国产化替代进程。</p>
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</div>
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<div class="glass-card p-6">
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<h4 class="font-bold text-lg text-pink-400 mb-3">周期性拐点 (23Q4-24Q1)</h4>
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<p class="text-sm">行业经历底部盘整后，晶圆厂稼动率显著回升（中芯国际66%→75%，晶合集成60%→90%），直接转化为对材料（OPEX）需求的复苏。</p>
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</div>
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<div class="glass-card p-6">
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<h4 class="font-bold text-lg text-sky-400 mb-3">AI新浪潮催化 (2024+)</h4>
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<p class="text-sm">HBM和先进封装需求爆发，成为新的结构性增长引擎，直接拉动对上游前驱体、low-α球硅等先进封装材料的需求，业绩验证拐点出现。</p>
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</div>
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</div>
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</section>
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<!-- Section 1: 核心观点 -->
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<section class="glow-border">
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<div class="glass-card p-8">
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<h3 class="text-2xl font-bold mb-4 text-white tracking-wider">核心观点摘要</h3>
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<p class="text-lg leading-relaxed text-gray-200">
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半导体材料正处于一个<strong class="text-transparent bg-clip-text bg-gradient-to-r from-green-300 via-blue-500 to-purple-600">“周期性复苏”</strong>与<strong class="text-transparent bg-clip-text bg-gradient-to-r from-yellow-200 via-red-500 to-fuchsia-500">“结构性成长”</strong>双击的历史性拐点。其核心驱动力已演变为由<strong class="text-cyan-300">AI驱动的新需求</strong>、<strong class="text-amber-300">地缘政治倒逼的供应链重塑</strong>、以及<strong class="text-lime-300">行业周期回暖</strong>三股力量共同作用的复杂逻辑。当前市场认知普遍乐观，但对高端材料国产替代的难度和周期可能存在预期差，真正的投资机会在于那些已在关键领域（如先进光刻胶、HBM相关材料）实现<strong class="text-red-400">“从0到1”</strong>突破，并能享受<strong class="text-green-400">“从1到10”</strong>放量红利的核心企业。
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</p>
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</div>
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</section>
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<!-- Section 2: 核心逻辑与市场认知 -->
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<section>
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<h3 class="text-2xl font-bold mb-6 text-white tracking-wider">核心逻辑与市场认知</h3>
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<div class="bento-grid">
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<div class="glass-card p-6 lg:grid-col-span-2">
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<h4 class="font-bold text-lg text-purple-400 mb-3">需求侧：三元驱动</h4>
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<ul class="space-y-3 text-sm">
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<li><strong class="text-lime-300">周期性复苏:</strong> 存储市场回暖，晶圆厂稼动率提升，增加对抛光液、电子特气等消耗性材料的需求，构成基本盘。</li>
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<li><strong class="text-cyan-300">AI结构性增量:</strong> AI服务器、HBM对先进封装（FCBGA, Chiplet）需求是纯增量市场，价值量更高，利好联瑞新材、雅克科技等。</li>
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<li><strong class="text-amber-300">国产化替代:</strong> 最具确定性的长期逻辑。未来3-5年是产能扩张“黄金窗口期”，BIS取消豁免预期加速晶圆厂导入意愿。</li>
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</ul>
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</div>
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<div class="glass-card p-6">
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<h4 class="font-bold text-lg text-pink-400 mb-3">供给侧：从“可用”到“好用”</h4>
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<p class="text-sm">国内厂商多年投入后，产品矩阵和技术水平持续提升。例如华特气体的特气进入5nm工艺认证；彤程新材的ArF光刻胶实现量产出货，供给能力提升是国产替代的前提。</p>
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</div>
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<div class="glass-card p-6 lg:grid-row-span-2 glow-border">
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<h4 class="font-bold text-lg text-red-400 mb-3">【核心预期差】国产替代的速度与广度</h4>
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<p class="text-base font-semibold text-gray-100 mb-2">市场普遍认知：</p>
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<p class="text-sm mb-4">在宏大叙事下，市场倾向于认为国产替代正全面、快速地推进。</p>
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<p class="text-base font-semibold text-gray-100 mb-2">潜在真相 (基于专家纪要交叉验证)：</p>
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<p class="text-sm">在高端封装领域，国产替代进程<strong class="text-red-400">远比想象中慢</strong>。华为在核心芯片上仍优先选择台湾健策的散热片，国产供应商仅用于非核心产品备份。高端Molding Compound、IC载板仍由日、台主导。<strong>市场可能高估了短期内在高端应用的替代速度。</strong></p>
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</div>
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<div class="glass-card p-6 lg:grid-col-span-2">
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<h4 class="font-bold text-lg text-sky-400 mb-3">【资金配置预期差】机构持仓显著低配</h4>
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<p class="text-sm mb-4">尽管舆论火热，但机构资金实际配置远未到位。路演数据显示，2024Q1公募基金重仓股中，材料板块市值占比远低于设备，存在巨大的“补票”空间，是潜在上涨动力。</p>
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<div id="fundAllocationChart" style="width: 100%; height: 250px;"></div>
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</div>
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</div>
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</section>
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<!-- Section 3: 催化剂与发展路径 -->
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<section>
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<h3 class="text-2xl font-bold mb-6 text-white tracking-wider">关键催化剂与发展路径</h3>
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<div class="grid grid-cols-1 lg:grid-cols-2 gap-6">
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<div class="glass-card p-6">
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<h4 class="font-bold text-lg text-amber-400 mb-4">近期催化剂 (未来3-6个月)</h4>
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<ul class="space-y-4">
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<li class="flex items-start">
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<svg xmlns="http://www.w3.org/2000/svg" class="h-6 w-6 mr-3 text-amber-400 flex-shrink-0" fill="none" viewBox="0 0 24 24" stroke="currentColor"><path stroke-linecap="round" stroke-linejoin="round" stroke-width="2" d="M12 8v4l3 3m6-3a9 9 0 11-18 0 9 9 0 0118 0z" /></svg>
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<div><strong>BIS豁免政策落地:</strong> 若正式取消，将是引爆板块的最强催化剂，国产替代从“选择题”变为“必答题”。</div>
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</li>
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<li class="flex items-start">
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<svg xmlns="http://www.w3.org/2000/svg" class="h-6 w-6 mr-3 text-amber-400 flex-shrink-0" fill="none" viewBox="0 0 24 24" stroke="currentColor"><path stroke-linecap="round" stroke-linejoin="round" stroke-width="2" d="M9 12l2 2 4-4m6 2a9 9 0 11-18 0 9 9 0 0118 0z" /></svg>
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<div><strong>核心公司业绩验证:</strong> 2024年中报和三季报是关键试金石，验证行业景气度和国产化成果。</div>
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</li>
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<li class="flex items-start">
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<svg xmlns="http://www.w3.org/2000/svg" class="h-6 w-6 mr-3 text-amber-400 flex-shrink-0" fill="none" viewBox="0 0 24 24" stroke="currentColor"><path stroke-linecap="round" stroke-linejoin="round" stroke-width="2" d="M9 19v-6a2 2 0 00-2-2H5a2 2 0 00-2 2v6a2 2 0 002 2h2a2 2 0 002-2zm0 0V9a2 2 0 012-2h2a2 2 0 012 2v10m-6 0a2 2 0 002 2h2a2 2 0 002-2m0 0V5a2 2 0 012-2h2a2 2 0 012 2v14a2 2 0 01-2 2h-2a2 2 0 01-2-2z" /></svg>
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<div><strong>HBM/先进封装材料认证突破:</strong> 任何一项“从0到1”的客户认证突破都可能引爆相关公司股价。</div>
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</li>
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</ul>
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</div>
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<div class="glass-card p-6">
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<h4 class="font-bold text-lg text-indigo-400 mb-4">长期发展路径</h4>
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<div class="timeline">
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<div class="timeline-item">
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<h5 class="font-semibold text-indigo-300">第一阶段 (当前)</h5>
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<p class="text-sm">在成熟制程和非核心环节实现全面替代，以量取胜。代表领域：部分湿电子化学品、靶材、CMP抛光垫。</p>
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</div>
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<div class="timeline-item">
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<h5 class="font-semibold text-indigo-300">第二阶段 (未来2-3年)</h5>
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<p class="text-sm">在先进制程和关键环节实现“从0到1”的突破，并开始小批量供货。代表领域：ArF光刻胶、高端电子特气、HBM封装材料。</p>
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</div>
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<div class="timeline-item">
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<h5 class="font-semibold text-indigo-300">第三阶段 (未来3-5年)</h5>
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<p class="text-sm">在关键材料领域实现“从1到10”的份额提升，并具备全球竞争力，甚至“出海卡位”。代表领域：全品类的先进制程材料。</p>
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</div>
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</div>
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</div>
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</div>
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</section>
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<!-- Section 4: 产业链与核心公司 -->
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<section x-data="{ tab: 'platform' }">
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<h3 class="text-2xl font-bold mb-6 text-white tracking-wider">产业链与核心公司剖析</h3>
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<div class="glass-card p-6 mb-6">
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<h4 class="font-bold text-lg text-cyan-400 mb-3">产业链图谱</h4>
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<div class="flex flex-col md:flex-row justify-between items-center text-center text-sm space-y-4 md:space-y-0">
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<div class="p-3 bg-white/5 rounded-lg w-full md:w-auto"><strong>上游</strong><br>基础化工原料</div>
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<div class="text-cyan-400 font-bold text-2xl transform md:rotate-0 rotate-90">→</div>
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<div class="p-3 bg-cyan-400/20 rounded-lg border border-cyan-400 w-full md:w-auto"><strong>中游 (核心)</strong><br>半导体材料制造</div>
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<div class="text-cyan-400 font-bold text-2xl transform md:rotate-0 rotate-90">→</div>
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<div class="p-3 bg-white/5 rounded-lg w-full md:w-auto"><strong>下游</strong><br>晶圆厂/封测厂</div>
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</div>
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</div>
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<div class="tabs tabs-boxed bg-white/5 mb-6">
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<a class="tab tab-lg" :class="{ 'tab-active': tab === 'platform' }" @click="tab = 'platform'">平台化龙头 vs 专精特新</a>
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<a class="tab tab-lg" :class="{ 'tab-active': tab === 'bottleneck' }" @click="tab = 'bottleneck'">“卡脖子”环节攻坚者</a>
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<a class="tab tab-lg" :class="{ 'tab-active': tab === 'leader' }" @click="tab = 'leader'">领导者与追赶者</a>
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</div>
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<div class="glass-card p-6 min-h-[20rem]">
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<div x-show="tab === 'platform'" x-transition>
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<div class="grid grid-cols-1 md:grid-cols-2 gap-6">
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<div>
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<h5 class="font-bold text-lg text-purple-400">鼎龙股份</h5>
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<p class="text-sm">典型的平台化布局公司，在<strong>CMP抛光垫</strong>领域打破陶氏垄断，实现国产龙头，同时横向拓展YPI/PSPI、光刻胶等。逻辑是通过单点成功，横向复制。</p>
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</div>
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<div>
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<h5 class="font-bold text-lg text-pink-400">安集科技</h5>
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<p class="text-sm">半导体材料“血统”最纯正的公司之一，深耕<strong>CMP抛光液</strong>和功能性湿电子化学品。优势在于技术深度和客户黏性，是抛光液领域国产标杆。</p>
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</div>
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</div>
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</div>
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<div x-show="tab === 'bottleneck'" x-transition>
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<div class="grid grid-cols-1 md:grid-cols-2 gap-6">
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<div>
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<h5 class="font-bold text-lg text-green-400">雅克科技</h5>
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<p class="text-sm">通过外延并购成为<strong>前驱体</strong>材料全球龙头之一，且是国内<strong>唯一HBM国产供应商</strong>。逻辑最硬，直接受益于AI和存储两大最强趋势，确定性高。</p>
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</div>
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<div>
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<h5 class="font-bold text-lg text-yellow-400">彤程新材</h5>
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||
<p class="text-sm"><strong>光刻胶</strong>领域的追赶者，研报和路演证实其KrF/I线光刻胶已放量，ArF光刻胶已量产出货。光刻胶是国产替代皇冠上的明珠，一旦放量，估值弹性巨大。</p>
|
||
</div>
|
||
</div>
|
||
</div>
|
||
<div x-show="tab === 'leader'" x-transition>
|
||
<div class="grid grid-cols-1 md:grid-cols-2 gap-6">
|
||
<div>
|
||
<h5 class="font-bold text-lg text-blue-400">沪硅产业 (领导者)</h5>
|
||
<p class="text-sm">国内12英寸<strong>大硅片</strong>的领导者，但全球市场由日系巨头垄断（市占率超85%），国产化任重道远。</p>
|
||
</div>
|
||
<div>
|
||
<h5 class="font-bold text-lg text-orange-400">江丰电子 (全球玩家)</h5>
|
||
<p class="text-sm">全球第三、国内第一的<strong>靶材</strong>供应商，国产替代中走得最快的领域之一。其逻辑已从“国产替代”转向“全球扩张”。</p>
|
||
</div>
|
||
</div>
|
||
</div>
|
||
</div>
|
||
</section>
|
||
|
||
<!-- Section 5: 潜在风险 -->
|
||
<section>
|
||
<h3 class="text-2xl font-bold mb-6 text-white tracking-wider">潜在风险与挑战</h3>
|
||
<div class="grid grid-cols-1 md:grid-cols-3 gap-6">
|
||
<div class="glass-card p-6 border-l-4 border-yellow-500">
|
||
<h4 class="font-bold text-lg text-yellow-400 mb-3">技术风险</h4>
|
||
<p class="text-sm">高壁垒材料（如ArF/EUV光刻胶）研发失败风险；部分关键原材料或设备依赖进口，存在“二次卡脖子”风险。</p>
|
||
</div>
|
||
<div class="glass-card p-6 border-l-4 border-orange-500">
|
||
<h4 class="font-bold text-lg text-orange-400 mb-3">商业化风险</h4>
|
||
<p class="text-sm">客户验证周期长、壁垒高，高端应用转换意愿低。在国产化率高的领域（如靶材）容易陷入价格战，侵蚀利润。</p>
|
||
</div>
|
||
<div class="glass-card p-6 border-l-4 border-red-500">
|
||
<h4 class="font-bold text-lg text-red-400 mb-3">信息交叉验证风险</h4>
|
||
<p class="text-sm"><strong>最大矛盾点：</strong>研报/新闻的乐观宏大叙事 vs. 专家纪要的现实骨感。需警惕被宏大叙事催眠，忽略商业化落地的具体困难。</p>
|
||
</div>
|
||
</div>
|
||
</section>
|
||
|
||
<!-- Section 6: 结论与启示 -->
|
||
<section class="glass-card p-8">
|
||
<h3 class="text-2xl font-bold mb-6 text-white tracking-wider">综合结论与投资启示</h3>
|
||
<p class="mb-6">半导体材料已从纯粹的主题炒作进入<strong class="text-green-400">基本面驱动和业绩兑现</strong>的阶段。但并非所有子领域齐头并进，而是呈现结构性分化。这是一个值得长期配置的黄金赛道，但投资需要自下而上，精选个股。</p>
|
||
<div class="grid grid-cols-1 lg:grid-cols-2 gap-6">
|
||
<div>
|
||
<h4 class="font-bold text-lg text-cyan-400 mb-3">最具投资价值的细分环节</h4>
|
||
<ul class="list-disc list-inside space-y-2 text-sm">
|
||
<li><strong>高确定性+高壁垒:</strong> 与AI(HBM)、存储强相关的核心材料，国产化率低。首推<strong class="text-white">前驱体 (雅克科技)</strong>，其次是<strong class="text-white">先进光刻胶 (彤程新材)</strong>和<strong class="text-white">先进封装材料 (联瑞新材)</strong>。</li>
|
||
<li><strong>业绩兑现+份额提升:</strong> 已确立国内龙头地位，享受行业复苏和国产化放量的公司。代表为<strong class="text-white">CMP抛光垫 (鼎龙股份)</strong>和<strong class="text-white">CMP抛光液 (安集科技)</strong>。</li>
|
||
</ul>
|
||
</div>
|
||
<div>
|
||
<h4 class="font-bold text-lg text-pink-400 mb-3">需重点跟踪的关键指标</h4>
|
||
<ul class="list-disc list-inside space-y-2 text-sm">
|
||
<li>下游晶圆厂的季度稼动率和资本开支计划。</li>
|
||
<li>核心产品毛利率变化，判断竞争格局。</li>
|
||
<li>新产品通过下游大客户验证的公告 (“从0到1”信号)。</li>
|
||
<li>机构持仓比例变化 (判断大资金认可度)。</li>
|
||
</ul>
|
||
</div>
|
||
</div>
|
||
</section>
|
||
|
||
<!-- Stock Data -->
|
||
<section>
|
||
<h3 class="text-2xl font-bold mb-6 text-white tracking-wider text-center">核心标的池</h3>
|
||
<div class="glass-card overflow-x-auto p-4">
|
||
<table class="table table-zebra w-full">
|
||
<thead class="text-base text-gray-100">
|
||
<tr>
|
||
<th>股票名称</th>
|
||
<th>核心逻辑 / 理由</th>
|
||
<th>其他标签</th>
|
||
</tr>
|
||
</thead>
|
||
|
||
<tbody>
|
||
<tr><th colspan="3" class="text-center text-lg font-bold py-4 text-purple-300 tracking-widest">湿电子化学品</th></tr>
|
||
<tr>
|
||
<td><a href="https://valuefrontier.cn/company?scode=688545" target="_blank" class="link link-hover">兴福电子 (688545)</a></td>
|
||
<td>23年电子级磷酸国内占有率超60%，硫酸占31.22%，已供应台积电、中芯国际、长存等</td>
|
||
<td>湿电子化学品</td>
|
||
</tr>
|
||
<tr>
|
||
<td><a href="https://valuefrontier.cn/company?scode=603931" target="_blank" class="link link-hover">格林达 (603931)</a></td>
|
||
<td>18年显影液国内市场占有率43.95%，将适时扩充TMAH、BOE蚀刻液等产能</td>
|
||
<td>湿电子化学品</td>
|
||
</tr>
|
||
<tr>
|
||
<td><a href="https://valuefrontier.cn/company?scode=603078" target="_blank" class="link link-hover">江化微 (603078)</a></td>
|
||
<td>专注于高纯湿电子化学品，主营超净高纯试剂、光刻胶配套试剂等</td>
|
||
<td>湿电子化学品</td>
|
||
</tr>
|
||
<tr>
|
||
<td><a href="https://valuefrontier.cn/company?scode=300655" target="_blank" class="link link-hover">晶瑞电材 (300655)</a></td>
|
||
<td>紫外宽谱光刻胶市占率第一，高纯双氧水、硫酸等达SEMI G5等级</td>
|
||
<td>湿电子化学品, 光刻胶</td>
|
||
</tr>
|
||
<tr>
|
||
<td><a href="https://valuefrontier.cn/company?scode=688019" target="_blank" class="link link-hover">安集科技 (688019)</a></td>
|
||
<td>产品包括化学机械抛光液、功能性湿电子化学品和电镀液及添加剂</td>
|
||
<td>湿电子化学品, 抛光材料</td>
|
||
</tr>
|
||
<tr>
|
||
<td><a href="https://valuefrontier.cn/company?scode=300236" target="_blank" class="link link-hover">上海新阳 (300236)</a></td>
|
||
<td>集成电路制造用电镀液、清洗液，光刻胶材料已有多个品类在规模化销售</td>
|
||
<td>湿电子化学品, 光刻胶</td>
|
||
</tr>
|
||
<tr>
|
||
<td><a href="https://valuefrontier.cn/company?scode=002407" target="_blank" class="link link-hover">多氟多 (002407)</a></td>
|
||
<td>在建3万吨超净高纯湿电子化学品项目，以电子级氢氟酸为代表</td>
|
||
<td>湿电子化学品</td>
|
||
</tr>
|
||
<tr>
|
||
<td><a href="https://valuefrontier.cn/company?scode=300037" target="_blank" class="link link-hover">新宙邦 (300037)</a></td>
|
||
<td>包含半导体级双氧水(G5)、氨水(G6 <1ppt)、蚀刻液、剥离液、清洗液等</td>
|
||
<td>湿电子化学品</td>
|
||
</tr>
|
||
<tr><th colspan="3" class="text-center text-lg font-bold py-4 text-pink-300 tracking-widest">光掩膜版</th></tr>
|
||
<tr>
|
||
<td><a href="https://valuefrontier.cn/company?scode=688401" target="_blank" class="link link-hover">路维光电 (688401)</a></td>
|
||
<td>国内唯一一家拥有G11掩膜版生产线的公司</td>
|
||
<td>光掩膜版</td>
|
||
</tr>
|
||
<tr>
|
||
<td><a href="https://valuefrontier.cn/company?scode=688503" target="_blank" class="link link-hover">聚和材料 (688503)</a></td>
|
||
<td>计划收购SKE空白掩膜(Blank Mask)业务板块(LM公司)</td>
|
||
<td>光掩膜版</td>
|
||
</tr>
|
||
<tr>
|
||
<td><a href="https://valuefrontier.cn/company?scode=688138" target="_blank" class="link link-hover">清溢光电 (688138)</a></td>
|
||
<td>推出新型纳米压印半导体制造设备，将电路图形转移到晶圆上</td>
|
||
<td>光掩膜版</td>
|
||
</tr>
|
||
<tr><th colspan="3" class="text-center text-lg font-bold py-4 text-cyan-300 tracking-widest">溅射靶材</th></tr>
|
||
<tr>
|
||
<td><a href="https://valuefrontier.cn/company?scode=300666" target="_blank" class="link link-hover">江丰电子 (300666)</a></td>
|
||
<td>核心产品在国内12英寸晶圆厂市占率达73%，全球半导体靶材市占率约12%</td>
|
||
<td>溅射靶材</td>
|
||
</tr>
|
||
<tr>
|
||
<td><a href="https://valuefrontier.cn/company?scode=600206" target="_blank" class="link link-hover">有研新材 (600206)</a></td>
|
||
<td>“先进封装用高纯金属及合金溅射靶材”项目荣获省部级科学技术一等奖</td>
|
||
<td>溅射靶材</td>
|
||
</tr>
|
||
<tr>
|
||
<td><a href="https://valuefrontier.cn/company?scode=300706" target="_blank" class="link link-hover">阿石创 (300706)</a></td>
|
||
<td>产品主要分为蒸镀材料和溅射靶材两个系列，现有镍靶材、铜靶材等</td>
|
||
<td>溅射靶材</td>
|
||
</tr>
|
||
<tr><th colspan="3" class="text-center text-lg font-bold py-4 text-lime-300 tracking-widest">抛光材料</th></tr>
|
||
<tr>
|
||
<td><a href="https://valuefrontier.cn/company?scode=300054" target="_blank" class="link link-hover">鼎龙股份 (300054)</a></td>
|
||
<td>国内CMP抛光垫龙头企业，打破海外垄断</td>
|
||
<td>抛光材料</td>
|
||
</tr>
|
||
<tr>
|
||
<td><a href="https://valuefrontier.cn/company?scode=688019" target="_blank" class="link link-hover">安集科技 (688019)</a></td>
|
||
<td>化学机械抛光液板块已实现全品类产品线的布局和覆盖</td>
|
||
<td>抛光材料, 湿电子化学品</td>
|
||
</tr>
|
||
<tr><th colspan="3" class="text-center text-lg font-bold py-4 text-sky-300 tracking-widest">硅片</th></tr>
|
||
<tr>
|
||
<td><a href="https://valuefrontier.cn/company?scode=688126" target="_blank" class="link link-hover">沪硅产业 (688126)</a></td>
|
||
<td>首家实现300mm半导体硅片量产，年出货量突破500万片</td>
|
||
<td>硅片</td>
|
||
</tr>
|
||
<tr>
|
||
<td><a href="https://valuefrontier.cn/company?scode=605358" target="_blank" class="link link-hover">立昂微 (605358)</a></td>
|
||
<td>8英寸硅片市占率约18%，12英寸硅片实现量产并进入头部晶圆厂供应链</td>
|
||
<td>硅片</td>
|
||
</tr>
|
||
<tr>
|
||
<td><a href="https://valuefrontier.cn/company?scode=688233" target="_blank" class="link link-hover">神工股份 (688233)</a></td>
|
||
<td>大直径硅材料产品全市占率，比之前的13%-15%，有了进一步提高</td>
|
||
<td>硅片</td>
|
||
</tr>
|
||
<tr><th colspan="3" class="text-center text-lg font-bold py-4 text-yellow-300 tracking-widest">光刻胶</th></tr>
|
||
<tr>
|
||
<td><a href="https://valuefrontier.cn/company?scode=300346" target="_blank" class="link link-hover">南大光电 (300346)</a></td>
|
||
<td>国内唯一实现28nm及以下制程ArF光刻胶量产，在国内ArF光刻胶细分市场占有率约20%-30%</td>
|
||
<td>光刻胶, 电子特气</td>
|
||
</tr>
|
||
<tr>
|
||
<td><a href="https://valuefrontier.cn/company?scode=603650" target="_blank" class="link link-hover">彤程新材 (603650)</a></td>
|
||
<td>22年显示面板光刻胶营收3.30亿，国内市占率攀升至27.1%，半导体光刻胶已量产</td>
|
||
<td>光刻胶</td>
|
||
</tr>
|
||
<tr><th colspan="3" class="text-center text-lg font-bold py-4 text-orange-300 tracking-widest">电子特气</th></tr>
|
||
<tr>
|
||
<td><a href="https://valuefrontier.cn/company?scode=688268" target="_blank" class="link link-hover">华特气体 (688268)</a></td>
|
||
<td>年末实现55个产品进口替代，超20个产品供应到14nm及以下先进制程</td>
|
||
<td>电子特气</td>
|
||
</tr>
|
||
<tr>
|
||
<td><a href="https://valuefrontier.cn/company?scode=002409" target="_blank" class="link link-hover">雅克科技 (002409)</a></td>
|
||
<td>HBM前驱体全球龙头，高纯四氟化碳产能2000吨/年，高纯六氟化硫产能1200吨/年</td>
|
||
<td>电子特气, 前驱体</td>
|
||
</tr>
|
||
<tr><th colspan="3" class="text-center text-lg font-bold py-4 text-indigo-300 tracking-widest">封装材料</th></tr>
|
||
<tr>
|
||
<td><a href="https://valuefrontier.cn/company?scode=002916" target="_blank" class="link link-hover">深南电路 (002916)</a></td>
|
||
<td>FC-BGA封装基板现已具备20层及以下产品批量生产能力</td>
|
||
<td>封装基板</td>
|
||
</tr>
|
||
<tr>
|
||
<td><a href="https://valuefrontier.cn/company?scode=002436" target="_blank" class="link link-hover">兴森科技 (002436)</a></td>
|
||
<td>FCBGA封装基板可用于CPU，GPU，FPGA，ASIC等芯片的封装</td>
|
||
<td>封装基板</td>
|
||
</tr>
|
||
<tr>
|
||
<td><a href="https://valuefrontier.cn/company?scode=688535" target="_blank" class="link link-hover">华海诚科 (688535)</a></td>
|
||
<td>环氧塑封料国内市占率领先</td>
|
||
<td>环氧塑封料</td>
|
||
</tr>
|
||
</tbody>
|
||
</table>
|
||
</div>
|
||
</section>
|
||
|
||
</main>
|
||
|
||
<!-- Footer -->
|
||
<footer class="text-center py-8 mt-12">
|
||
<p class="text-sm text-gray-600">© 2024 价值前沿 | AI驱动的深度研究. 投资有风险，入市需谨慎。</p>
|
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</footer>
|
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