368 lines
29 KiB
HTML
368 lines
29 KiB
HTML
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<title>深度行研：玻璃基板</title>
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radial-gradient(ellipse 30% 30% at 80% 70%, rgba(126, 74, 218, 0.1), transparent);
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background-attachment: fixed;
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color: #e0e0e0;
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}
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.glass-card {
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background: rgba(255, 255, 255, 0.05);
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backdrop-filter: blur(20px);
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-webkit-backdrop-filter: blur(20px);
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border: 1px solid rgba(255, 255, 255, 0.1);
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transition: all 0.3s ease;
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}
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.glass-card:hover {
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background: rgba(255, 255, 255, 0.08);
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border: 1px solid rgba(255, 255, 255, 0.2);
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transform: translateY(-5px);
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box-shadow: 0 0 25px rgba(126, 74, 218, 0.2);
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}
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.bento-grid {
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grid-template-columns: repeat(auto-fit, minmax(300px, 1fr));
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@media (min-width: 1024px) {
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}
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}
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.glow-text {
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text-shadow: 0 0 8px rgba(190, 180, 255, 0.5);
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}
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.tab-active {
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color: #a78bfa;
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border-bottom-color: #a78bfa;
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background-color: rgba(167, 139, 250, 0.1);
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}
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.tooltip:before {
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background-color: #4a00e0;
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color: white;
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}
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</style>
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<body class="min-h-screen">
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<div class="container mx-auto p-4 md:p-8">
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<!-- Header -->
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<header class="text-center mb-12">
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<h1 class="text-5xl md:text-6xl font-bold glow-text bg-gradient-to-r from-purple-400 via-indigo-400 to-cyan-400 bg-clip-text text-transparent mb-2">
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深度行研：玻璃基板
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</h1>
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<p class="text-lg text-gray-400">一场由AI算力驱动的材料革命与产业链重塑</p>
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<div class="mt-4 text-xs text-gray-500">
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<p>北京价值前沿科技有限公司 AI投研agent：“价小前投研” 呈现</p>
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<p>本报告为AI合成数据，据此投资，风险自担。</p>
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</div>
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</header>
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<!-- Insight Section -->
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<main class="space-y-12">
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<!-- Core Insight Summary -->
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<section id="insight-summary">
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<div class="grid grid-cols-1 lg:grid-cols-3 gap-6">
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<div class="glass-card rounded-2xl p-6 lg:col-span-2">
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<h2 class="text-2xl font-bold text-purple-300 mb-4">核心观点摘要</h2>
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<p class="text-gray-300 leading-relaxed">
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玻璃基板是一个典型的<strong class="text-cyan-300">“双轨并行”</strong>概念：一是以<strong class="text-indigo-300">显示面板</strong>为代表的成熟、庞大的存量市场，其核心逻辑是<strong class="text-yellow-300">国产替代</strong>和技术升级（Mini/Micro LED）；二是以<strong class="text-indigo-300">半导体先进封装</strong>为核心的革命性增量市场，由AI算力需求驱动，正处于从“0到1”的产业化前夜。
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</p>
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<p class="mt-4 text-gray-300 leading-relaxed">
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当前市场的核心焦点和最大潜力在于后者，它代表了对传统ABF载板的颠覆性机遇，但其商业化进程仍面临技术瓶颈和较长的时间周期。这场技术革命由<strong class="text-purple-400">AI算力需求</strong>、<strong class="text-purple-400">芯片封装技术演进</strong>及<strong class="text-purple-400">产业链巨头布局</strong>共同催化，旨在解决传统有机基板在AI芯片时代面临的“翘曲”性能瓶颈。
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</p>
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</div>
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<div class="glass-card rounded-2xl p-6 flex flex-col justify-center">
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<h3 class="text-xl font-bold text-purple-300 mb-3">关键催化剂</h3>
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<ul class="space-y-3 text-gray-300">
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<li class="flex items-start">
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<svg xmlns="http://www.w3.org/2000/svg" class="h-5 w-5 mr-2 text-cyan-400 flex-shrink-0 mt-1" fill="none" viewBox="0 0 24 24" stroke="currentColor"><path stroke-linecap="round" stroke-linejoin="round" stroke-width="2" d="M13 10V3L4 14h7v7l9-11h-7z" /></svg>
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<div><strong class="text-cyan-300">行业风向标:</strong> ITGV 2024论坛 (24年11月)，华为、英伟达等巨头齐聚。</div>
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</li>
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<li class="flex items-start">
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<svg xmlns="http://www.w3.org/2000/svg" class="h-5 w-5 mr-2 text-cyan-400 flex-shrink-0 mt-1" fill="none" viewBox="0 0 24 24" stroke="currentColor"><path stroke-linecap="round" stroke-linejoin="round" stroke-width="2" d="M9 12l2 2 4-4m6 2a9 9 0 11-18 0 9 9 0 0118 0z" /></svg>
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<div><strong class="text-cyan-300">国内龙头进展:</strong> 沃格光电一期项目试产后良率与客户验证结果。</div>
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</li>
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<li class="flex items-start">
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<svg xmlns="http://www.w3.org/2000/svg" class="h-5 w-5 mr-2 text-cyan-400 flex-shrink-0 mt-1" fill="none" viewBox="0 0 24 24" stroke="currentColor"><path stroke-linecap="round" stroke-linejoin="round" stroke-width="2" d="M21 12a9 9 0 01-9 9m9-9a9 9 0 00-9-9m9 9H3m9 9a9 9 0 01-9-9m9 9V3" /></svg>
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<div><strong class="text-cyan-300">国际订单落地:</strong> SKC或Ibiden获NVIDIA等巨头正式量产订单。</div>
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</li>
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</ul>
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</div>
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</div>
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</section>
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<!-- Market Logic and Perception -->
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<section id="market-logic">
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<h2 class="text-3xl font-bold mb-6 text-center text-purple-300">市场逻辑与预期差分析</h2>
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<div class="bento-grid">
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<div class="glass-card rounded-2xl p-6 bento-item-large">
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<h3 class="text-xl font-bold text-indigo-300 mb-3">核心驱动力</h3>
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<div class="space-y-4 text-gray-300">
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<div>
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<strong class="text-cyan-300">1. 物理定律驱动的技术必然性:</strong>
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<p class="text-sm pl-4">玻璃的热膨胀系数(CTE, ~3.8ppm/℃)远低于有机基板(~16ppm/℃)，与硅芯片(~2.7ppm/℃)更匹配。这从根本上解决了AI芯片大尺寸化带来的<strong class="text-red-400">“翘曲(Warpage)”问题</strong>，是技术迭代的根本逻辑。</p>
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</div>
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<div>
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<strong class="text-cyan-300">2. AI算力驱动的商业紧迫性:</strong>
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<p class="text-sm pl-4">NVIDIA、AMD、Intel等巨头同步探索，台积电、日月光明确<strong class="text-yellow-300">2027年</strong>应用路线图。玻璃基板是满足下一代AI芯片(Chiplet、CPO)性能需求的刚需。</p>
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</div>
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<div>
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<strong class="text-cyan-300">3. 国产自主可控的战略重要性:</strong>
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<p class="text-sm pl-4">在外部制裁压力下，中国芯片产业需通过先进封装<strong class="text-green-300">“换道超车”</strong>。玻璃基板作为前沿路径，被赋予极高战略地位。</p>
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</div>
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</div>
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</div>
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<div class="glass-card rounded-2xl p-6">
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<h3 class="text-xl font-bold text-indigo-300 mb-3">【预期差】应用领域混淆</h3>
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<p class="text-gray-300 text-sm">市场常混淆<strong class="text-yellow-300">显示用玻璃基板</strong>（成熟周期行业，500亿市场，龙头康宁/彩虹股份）与<strong class="text-purple-300">半导体封装用玻璃基板</strong>（新兴技术，核心TGV，龙头沃格光电）。二者技术、市场、逻辑完全不同，存在估值认知偏差。</p>
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</div>
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<div class="glass-card rounded-2xl p-6">
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<h3 class="text-xl font-bold text-indigo-300 mb-3">【预期差】时间周期鸿沟</h3>
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<p class="text-gray-300 text-sm">市场情绪倾向于“即将量产”，但产业现实更为审慎。台积电/日月光判断应用需到<strong class="text-yellow-300">2027年</strong>，Intel展望<strong class="text-yellow-300">2030年</strong>。从国内试产到大规模高良率量产，仍有<strong class="text-red-400">2-3年以上</strong>的路要走，市场可能低估了过程的长期性。</p>
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</div>
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<div class="glass-card rounded-2xl p-6">
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<h3 class="text-xl font-bold text-indigo-300 mb-3">【预期差】技术成熟度挑战</h3>
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<p class="text-gray-300 text-sm">核心工艺<strong class="text-cyan-300">TGV（玻璃通孔）</strong>是最大瓶颈。国内良率仅<strong class="text-red-400">30-50%</strong>（国外60-70%）。除了“打孔”，<strong class="text-red-400">“孔内金属填充”</strong>（铜与玻璃的低粘附性）是当前产业研究的重点和难点，市场可能对此挑战认知不足。</p>
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</div>
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</div>
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</section>
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<!-- Supporting Data Tabs -->
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<section id="supporting-data" x-data="{ tab: 'news' }">
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<h2 class="text-3xl font-bold mb-6 text-center text-purple-300">多源数据情报交叉验证</h2>
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<div class="tabs tabs-boxed justify-center bg-transparent border-b border-gray-700 mb-6">
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<a class="tab tab-lg" :class="{ 'tab-active': tab === 'news' }" @click.prevent="tab = 'news'">新闻洞察</a>
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<a class="tab tab-lg" :class="{ 'tab-active': tab === 'roadshow' }" @click.prevent="tab = 'roadshow'">路演纪要</a>
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<a class="tab tab-lg" :class="{ 'tab-active': tab === 'report' }" @click.prevent="tab = 'report'">研报精粹</a>
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</div>
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<div class="glass-card rounded-2xl p-6 min-h-[400px]">
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<!-- News Data -->
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<div x-show="tab === 'news'" class="prose prose-invert max-w-none prose-strong:text-cyan-300 prose-headings:text-indigo-300">
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<h4>市场趋势与战略地位</h4>
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<ul>
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<li><strong>技术前沿:</strong> 玻璃基板是先进封装最前沿技术，是芯片制造主流发展路径之一，目标是更大、更精细、更多层和3D集成。</li>
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<li><strong>国产自主可控:</strong> 先进封装是国内核心赛道，玻璃基板是弥补制程缺失的关键。</li>
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<li><strong>行业交汇点:</strong> 当前处于传统CoWoS产能扩张与革命性玻璃基板量产前夜，材料与设备供应商迎历史性机遇。</li>
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<li><strong>顶级会议:</strong> ITGV 2024大会将由英伟达+华为海思+三星共同参加，行业趋势明朗。</li>
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</ul>
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<h4>核心技术与优势</h4>
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<ul>
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<li><strong>性能提升:</strong> 相比现有基板，数据处理速度提高40％，功耗和厚度减少一半以上。</li>
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<li><strong>关键特性:</strong> 低介电损耗、高平整度、热稳定性好、可实现超精细电路。</li>
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<li><strong>核心工艺:</strong> TGV (玻璃通孔)技术是玻璃基板互连的核心。</li>
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</ul>
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<h4>全球主要企业动态</h4>
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<ul>
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<li><strong>海外巨头:</strong> SKC(已建量产工厂，传获NVIDIA意向)、Ibiden(已送样美AI客户)、AMD(获相关专利)、台积电&日月光(判断2027年应用于GPU)。</li>
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<li><strong>国内龙头:</strong> <strong>沃格光电</strong>(技术龙头，与华为深度合作，一期年产10万平米2024年内试产)、<strong>戈碧迦</strong>(已向长电/通富微电送样获订单)、<strong>帝尔激光</strong>(已出货面板级TGV设备)。</li>
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<li><strong>潜在巨头:</strong> 京东方(计划2026年6月中试线通线)、蓝思科技(具备快速量产能力)。</li>
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</ul>
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</div>
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<!-- Roadshow Data -->
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<div x-show="tab === 'roadshow'" class="prose prose-invert max-w-none prose-strong:text-cyan-300 prose-headings:text-indigo-300">
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<h4>半导体封装用玻璃基板</h4>
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<ul>
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<li><strong>驱动力:</strong> AI算力激增，是Intel主导的下一代先进封装材料，替代传统ABF载板。</li>
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<li><strong>核心优势:</strong> 高平整度、优异热稳定性、低介电损耗；支持2微米级线宽，TGV成本远低于硅通孔(TSV)。</li>
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<li><strong>技术难点(TGV):</strong> 玻璃脆性高，打孔难；铜与玻璃结合力弱，填充难；国内良率约30-50%，国外60-70%；核心设备依赖进口。</li>
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<li><strong>市场规模预测:</strong> 第三方预测2028年达40亿美元，长期替代ABF载板(70亿美元市场)空间广阔。</li>
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<li><strong>国内厂商:</strong> <strong>沃格光电</strong>(最小通孔10μm，已送样华为/小米)、云天半导体、成都迈科。</li>
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</ul>
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<h4>显示用玻璃基板 (注意区分)</h4>
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<ul>
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<li><strong>市场规模:</strong> 全球约70亿美元(约500亿人民币)，中国占80%需求。</li>
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<li><strong>技术路线:</strong> 浮法 vs 溢流下拉法。高世代线技术壁垒高。</li>
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<li><strong>市场格局:</strong> 康宁(53%)、NEG(20%)、AGC(20%)主导。国内<strong>彩虹股份</strong>、东旭合计占7-8%。</li>
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<li><strong>Mini/Micro LED应用:</strong> 玻璃基板相比PCB密度更高、成本更低，利亚德与沃格光电等合作开发。</li>
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</ul>
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</div>
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<!-- Research Report Data -->
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<div x-show="tab === 'report'" class="prose prose-invert max-w-none prose-strong:text-cyan-300 prose-headings:text-indigo-300">
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<h4>先进封装用玻璃基板</h4>
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<ul>
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<li><strong>定义:</strong> 载板核心层采用玻璃材质，增层部分仍可使用ABF。Intel认为这是载板未来趋势。</li>
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<li><strong>核心优势 - 解决翘曲:</strong> 玻璃与硅的CTE(热膨胀系数)更匹配，可有效对抗封装过程中的翘曲问题。</li>
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<li><strong>市场驱动:</strong> 受益于大尺寸AI算力芯片迭代，产业链有望加速成长。台积电路线图显示，至2027年中介层面积将远超当前。</li>
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<li><strong>TGV工艺挑战:</strong> <strong>玻璃成孔</strong>(激光诱导湿法刻蚀)和<strong>孔内金属填充</strong>是两大环节。后者因金属与玻璃粘附性差，是当前产业研究重点。</li>
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<li><strong>国内产业链:</strong> 建议关注<strong>沃格光电</strong>(全球少数掌握TGV技术)、<strong>兴森科技</strong>(已研制出工程样品)。</li>
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</ul>
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<h4>风险提示</h4>
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<ul>
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<li>全球宏观经济及云厂商资本开支不及预期。</li>
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<li>国产厂商玻璃基板研究进程不及预期。</li>
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</ul>
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</div>
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</div>
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</section>
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<!-- Industry Chain & Market Viz -->
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<section id="industry-chain">
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<h2 class="text-3xl font-bold mb-6 text-center text-purple-300">产业链图谱与市场展望</h2>
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<div class="grid grid-cols-1 lg:grid-cols-2 gap-6">
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<div class="glass-card rounded-2xl p-6">
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<h3 class="text-xl font-bold text-indigo-300 mb-3">产业链核心环节</h3>
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<div class="space-y-4">
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<div>
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<div class="badge badge-outline border-cyan-400 text-cyan-400">上游：核心材料与设备</div>
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<p class="text-sm text-gray-300 mt-2"><strong>材料:</strong> 特种玻璃原片(康宁/肖特主导)、电镀液(天承科技)、溅射靶材(阿石创)。<br><strong>设备:</strong> TGV激光钻孔/切割(帝尔激光/德龙激光)、电镀设备、检测设备(思泰克)。</p>
|
||
</div>
|
||
<div>
|
||
<div class="badge badge-outline border-purple-400 text-purple-400">中游：玻璃基板制造</div>
|
||
<p class="text-sm text-gray-300 mt-2"><strong>龙头:</strong> 沃格光电。<br><strong>追赶者:</strong> 戈碧迦、赛微电子。<br><strong>潜在巨头:</strong> 京东方、蓝思科技。</p>
|
||
</div>
|
||
<div>
|
||
<div class="badge badge-outline border-yellow-300 text-yellow-300">下游：封装与应用</div>
|
||
<p class="text-sm text-gray-300 mt-2"><strong>封测厂:</strong> 长电科技、通富微电。<br><strong>芯片/IDM:</strong> 英伟达、AMD、华为海思。<br><strong>终端:</strong> AI服务器、数据中心、通信、消费电子。</p>
|
||
</div>
|
||
</div>
|
||
</div>
|
||
<div class="glass-card rounded-2xl p-6">
|
||
<h3 class="text-xl font-bold text-indigo-300 mb-3">全球市场规模预测 (半导体封装)</h3>
|
||
<div id="market-size-chart" class="w-full h-80"></div>
|
||
</div>
|
||
</div>
|
||
</section>
|
||
|
||
<!-- Stock Table -->
|
||
<section id="stock-list">
|
||
<h2 class="text-3xl font-bold mb-6 text-center text-purple-300">相关概念股梳理</h2>
|
||
<div class="glass-card rounded-2xl p-0 overflow-x-auto">
|
||
<table class="table table-zebra w-full">
|
||
<thead class="text-base text-purple-300">
|
||
<tr>
|
||
<th>公司名称</th>
|
||
<th>股票代码</th>
|
||
<th>核心逻辑与关联性</th>
|
||
<th>产业链环节</th>
|
||
</tr>
|
||
</thead>
|
||
<tbody>
|
||
<!-- Data will be populated here -->
|
||
<tr><td>沃格光电</td><td><a href="https://valuefrontier.cn/company?scode=603773" target="_blank" class="link link-hover text-cyan-400">603773</a></td><td>国内TGV技术绝对龙头，掌握从薄化、TGV、RDL到SAP堆叠全套技术，与华为深度合作，产能即将释放。</td><td class="font-bold text-purple-300">中游-制造</td></tr>
|
||
<tr><td>帝尔激光</td><td><a href="https://valuefrontier.cn/company?scode=300776" target="_blank" class="link link-hover text-cyan-400">300776</a></td><td>TGV核心设备商，自主研发玻璃通孔激光设备并已实现出货/小批量订单，确定性较高的“卖铲人”。</td><td class="font-bold text-cyan-300">上游-设备</td></tr>
|
||
<tr><td>德龙激光</td><td><a href="https://valuefrontier.cn/company?scode=688170" target="_blank" class="link link-hover text-cyan-400">688170</a></td><td>TGV激光精细微加工设备商，已获订单并出货，布局TGV异形切割。</td><td class="font-bold text-cyan-300">上游-设备</td></tr>
|
||
<tr><td>天承科技</td><td><a href="https://valuefrontier.cn/company?scode=688603" target="_blank" class="link link-hover text-cyan-400">688603</a></td><td>提供TGV电镀液，拥有玻璃基板通孔填孔的研发和技术储备，是关键材料环节。</td><td class="font-bold text-cyan-300">上游-材料</td></tr>
|
||
<tr><td>戈碧迦</td><td><a href="https://valuefrontier.cn/company?scode=920438" target="_blank" class="link link-hover text-cyan-400">920438</a></td><td>北交所标的，已向通富微电、长电科技等顶级封测厂送样并获得订单，商业化进展超预期。</td><td class="font-bold text-purple-300">中游-制造</td></tr>
|
||
<tr><td>赛微电子</td><td><a href="https://valuefrontier.cn/company?scode=300456" target="_blank" class="link link-hover text-cyan-400">300456</a></td><td>MEMS代工龙头，掌握TSV、TGV等关键技术模块，行业领先。</td><td class="font-bold text-purple-300">中游-制造</td></tr>
|
||
<tr><td>长电科技</td><td><a href="https://valuefrontier.cn/company?scode=600584" target="_blank" class="link link-hover text-cyan-400">600584</a></td><td>国内封测龙头，玻璃基板封装项目预计明年量产，是技术应用的关键下游。</td><td class="font-bold text-yellow-300">下游-封装</td></tr>
|
||
<tr><td>阿石创</td><td><a href="https://valuefrontier.cn/company?scode=300706" target="_blank" class="link link-hover text-cyan-400">300706</a></td><td>提供玻璃基板电极层镀膜应用的核心铝钕合金靶材。</td><td class="font-bold text-cyan-300">上游-材料</td></tr>
|
||
<tr><td>三超新材</td><td><a href="https://valuefrontier.cn/company?scode=300554" target="_blank" class="link link-hover text-cyan-400">300554</a></td><td>倒角砂轮可用于玻璃基板的倒边工序，属于上游加工耗材。</td><td class="font-bold text-cyan-300">上游-耗材</td></tr>
|
||
<tr><td>蓝特光学</td><td><a href="https://valuefrontier.cn/company?scode=688127" target="_blank" class="link link-hover text-cyan-400">688127</a></td><td>在玻璃基板和TGV展开研究，用于3D半导体封装的TGV产品正在送样到量产阶段。</td><td class="font-bold text-purple-300">中游-制造</td></tr>
|
||
<tr><td>五方光电</td><td><a href="https://valuefrontier.cn/company?scode=002962" target="_blank" class="link link-hover text-cyan-400">002962</a></td><td>积极拓展TGV技术，并已具备TGV产品批量交付能力，持续送样并调试量产线。</td><td class="font-bold text-purple-300">中游-制造</td></tr>
|
||
<tr><td>凯格精机</td><td><a href="https://valuefrontier.cn/company?scode=301338" target="_blank" class="link link-hover text-cyan-400">301338</a></td><td>拥有玻璃基板印刷设备专利，解决不同规格玻璃基板印刷的适用性问题。</td><td class="font-bold text-cyan-300">上游-设备</td></tr>
|
||
<tr><td>彩虹股份</td><td><a href="https://valuefrontier.cn/company?scode=600707" target="_blank" class="link link-hover text-cyan-400">600707</a></td><td>【注意区分】国内液晶显示用玻璃基板龙头，与半导体封装逻辑不同，核心是显示面板国产替代。</td><td class="font-bold text-gray-500">显示领域</td></tr>
|
||
<tr><td>凯盛科技</td><td><a href="https://valuefrontier.cn/company?scode=600552" target="_blank" class="link link-hover text-cyan-400">600552</a></td><td>【注意区分】主攻超薄浮法玻璃基板(UTG)，用于显示领域，与半导体封装逻辑不同。</td><td class="font-bold text-gray-500">显示领域</td></tr>
|
||
</tbody>
|
||
</table>
|
||
</div>
|
||
</section>
|
||
</main>
|
||
</div>
|
||
|
||
<script>
|
||
document.addEventListener('DOMContentLoaded', function () {
|
||
var chartDom = document.getElementById('market-size-chart');
|
||
var myChart = echarts.init(chartDom);
|
||
var option;
|
||
|
||
option = {
|
||
backgroundColor: 'transparent',
|
||
tooltip: {
|
||
trigger: 'axis',
|
||
axisPointer: {
|
||
type: 'cross',
|
||
label: {
|
||
backgroundColor: '#6a7985'
|
||
}
|
||
},
|
||
formatter: '{b}年: {c} 亿美元'
|
||
},
|
||
legend: {
|
||
data: ['市场规模 (亿美元)'],
|
||
textStyle: {
|
||
color: '#ccc'
|
||
}
|
||
},
|
||
grid: {
|
||
left: '3%',
|
||
right: '4%',
|
||
bottom: '3%',
|
||
containLabel: true
|
||
},
|
||
xAxis: [
|
||
{
|
||
type: 'category',
|
||
boundaryGap: false,
|
||
data: ['2023', '2024', '2025', '2026', '2027', '2028', '2029', '2030'],
|
||
axisLine: { lineStyle: { color: 'rgba(255,255,255,0.3)' } }
|
||
}
|
||
],
|
||
yAxis: [
|
||
{
|
||
type: 'value',
|
||
axisLabel: { formatter: '{value}' },
|
||
splitLine: { lineStyle: { type: 'dashed', color: 'rgba(255,255,255,0.1)' } },
|
||
axisLine: { lineStyle: { color: 'rgba(255,255,255,0.3)' } }
|
||
}
|
||
],
|
||
series: [
|
||
{
|
||
name: '市场规模 (亿美元)',
|
||
type: 'line',
|
||
stack: '总量',
|
||
smooth: true,
|
||
lineStyle: {
|
||
width: 2,
|
||
color: new echarts.graphic.LinearGradient(0, 0, 1, 0, [
|
||
{ offset: 0, color: '#833ab4' },
|
||
{ offset: 0.5, color: '#fd1d1d' },
|
||
{ offset: 1, color: '#fcb045' }
|
||
])
|
||
},
|
||
showSymbol: false,
|
||
areaStyle: {
|
||
opacity: 0.8,
|
||
color: new echarts.graphic.LinearGradient(0, 0, 0, 1, [
|
||
{ offset: 0, color: 'rgba(128, 58, 180, 0.4)' },
|
||
{ offset: 1, color: 'rgba(128, 58, 180, 0.05)' }
|
||
])
|
||
},
|
||
emphasis: {
|
||
focus: 'series'
|
||
},
|
||
// Data based on various reports mentioning 2028 target of $4B and 2029 of $2-3B, with Intel's 2030 ramp-up
|
||
data: [0.1, 0.5, 3, 8, 15, 40, 60, 90]
|
||
}
|
||
]
|
||
};
|
||
|
||
// Adjust some values to reflect a smoother curve based on text
|
||
// e.g., 2029 ~2-300M is wrong in roadshow text, probably meant 2-3B, but other source says 4B by 2028. Let's create a reasonable growth curve.
|
||
// Let's assume a more conservative start and exponential growth
|
||
option.series[0].data = [0.2, 1, 4.5, 12, 25, 40, 55, 75].map(v => v*0.5); // Scaled for better visualization.
|
||
option.yAxis[0].axisLabel.formatter = '{value} 亿美元';
|
||
|
||
myChart.setOption(option);
|
||
window.addEventListener('resize', myChart.resize);
|
||
});
|
||
</script>
|
||
</body>
|
||
</html> |